Semiconductor Packaging : : Materials Interaction and Reliability /

Semiconductor Packaging : : Materials Interaction and Reliability / / Andrea Chen, Randy Hsiao-Yu Lo.

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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VerfasserIn:
Chen, Andrea,
Lo, Randy Hsiao-Yu,
TeilnehmendeR:
Lo, Randy Hsiao-Yu,
Place / Publishing House:[Place of publication not identified] : : Taylor & Francis,, 2012.
Year of Publication:2012
Language:English
Physical Description:1 online resource (216 pages)
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spelling Chen, Andrea, author.
Semiconductor Packaging : Materials Interaction and Reliability / Andrea Chen, Randy Hsiao-Yu Lo.
Semiconductor Packaging
[Place of publication not identified] : Taylor & Francis, 2012.
1 online resource (216 pages)
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Description based on online resource; title from PDF title page (Taylor & Francis, viewed July 3, 2023).
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Section 1. Semiconductor packages -- section 2. Package reliability -- section 3. Materials used in semiconductor packaging -- section 4. The future.
Materials science.
Lo, Randy Hsiao-Yu, author.
language English
format eBook
author Chen, Andrea,
Lo, Randy Hsiao-Yu,
spellingShingle Chen, Andrea,
Lo, Randy Hsiao-Yu,
Semiconductor Packaging : Materials Interaction and Reliability /
Section 1. Semiconductor packages -- section 2. Package reliability -- section 3. Materials used in semiconductor packaging -- section 4. The future.
author_facet Chen, Andrea,
Lo, Randy Hsiao-Yu,
Lo, Randy Hsiao-Yu,
author_variant a c ac
r h y l rhy rhyl
author_role VerfasserIn
VerfasserIn
author2 Lo, Randy Hsiao-Yu,
author2_role TeilnehmendeR
author_sort Chen, Andrea,
title Semiconductor Packaging : Materials Interaction and Reliability /
title_sub Materials Interaction and Reliability /
title_full Semiconductor Packaging : Materials Interaction and Reliability / Andrea Chen, Randy Hsiao-Yu Lo.
title_fullStr Semiconductor Packaging : Materials Interaction and Reliability / Andrea Chen, Randy Hsiao-Yu Lo.
title_full_unstemmed Semiconductor Packaging : Materials Interaction and Reliability / Andrea Chen, Randy Hsiao-Yu Lo.
title_auth Semiconductor Packaging : Materials Interaction and Reliability /
title_alt Semiconductor Packaging
title_new Semiconductor Packaging :
title_sort semiconductor packaging : materials interaction and reliability /
publisher Taylor & Francis,
publishDate 2012
physical 1 online resource (216 pages)
contents Section 1. Semiconductor packages -- section 2. Package reliability -- section 3. Materials used in semiconductor packaging -- section 4. The future.
callnumber-first T - Technology
callnumber-subject TA - General and Civil Engineering
callnumber-label TA403
callnumber-sort TA 3403 C446 42012
illustrated Not Illustrated
dewey-hundreds 600 - Technology
dewey-tens 620 - Engineering
dewey-ones 620 - Engineering & allied operations
dewey-full 620.11
dewey-sort 3620.11
dewey-raw 620.11
dewey-search 620.11
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is_hierarchy_title Semiconductor Packaging : Materials Interaction and Reliability /
author2_original_writing_str_mv noLinkedField
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