Semiconductor Packaging : : Materials Interaction and Reliability / / Andrea Chen, Randy Hsiao-Yu Lo.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
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| Place / Publishing House: | [Place of publication not identified] : : Taylor & Francis,, 2012. |
| Year of Publication: | 2012 |
| Language: | English |
| Physical Description: | 1 online resource (216 pages) |
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| Other title: | Semiconductor Packaging |
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| Summary: | In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages. |
| Hierarchical level: | Monograph |
| Statement of Responsibility: | Andrea Chen, Randy Hsiao-Yu Lo. |