Semiconductor Packaging : : Materials Interaction and Reliability / / Andrea Chen, Randy Hsiao-Yu Lo.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
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| Place / Publishing House: | [Place of publication not identified] : : Taylor & Francis,, 2012. |
| Year of Publication: | 2012 |
| Language: | English |
| Physical Description: | 1 online resource (216 pages) |
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