Semiconductor Packaging : : Materials Interaction and Reliability / / Andrea Chen, Randy Hsiao-Yu Lo.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
Saved in:
| VerfasserIn: | |
|---|---|
| TeilnehmendeR: | |
| Place / Publishing House: | [Place of publication not identified] : : Taylor & Francis,, 2012. |
| Year of Publication: | 2012 |
| Language: | English |
| Physical Description: | 1 online resource (216 pages) |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 01927nam a2200301 i 4500 | ||
|---|---|---|---|
| 001 | 993598302004498 | ||
| 005 | 20230703195921.0 | ||
| 006 | m o d | ||
| 007 | cr ||||||||||| | ||
| 008 | 230703s2012 xx o 000 0 eng d | ||
| 035 | |a (CKB)5710000000124356 | ||
| 035 | |a (NjHacI)995710000000124356 | ||
| 035 | |a (EXLCZ)995710000000124356 | ||
| 040 | |a NjHacI |b eng |e rda |c NjHacl | ||
| 050 | 4 | |a TA403 |b .C446 2012 | |
| 082 | 0 | 4 | |a 620.11 |2 23 |
| 100 | 1 | |a Chen, Andrea, |e author. | |
| 245 | 1 | 0 | |a Semiconductor Packaging : |b Materials Interaction and Reliability / |c Andrea Chen, Randy Hsiao-Yu Lo. |
| 246 | |a Semiconductor Packaging | ||
| 264 | 1 | |a [Place of publication not identified] : |b Taylor & Francis, |c 2012. | |
| 300 | |a 1 online resource (216 pages) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 588 | |a Description based on online resource; title from PDF title page (Taylor & Francis, viewed July 3, 2023). | ||
| 520 | |a In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages. | ||
| 505 | 0 | |a Section 1. Semiconductor packages -- section 2. Package reliability -- section 3. Materials used in semiconductor packaging -- section 4. The future. | |
| 650 | 0 | |a Materials science. | |
| 700 | 1 | |a Lo, Randy Hsiao-Yu, |e author. | |
| 906 | |a BOOK | ||
| ADM | |b 2023-07-08 12:12:23 Europe/Vienna |f system |c marc21 |a 2023-05-13 19:27:32 Europe/Vienna |g false | ||
| AVE | |i DOAB Directory of Open Access Books |P DOAB Directory of Open Access Books |x https://eu02.alma.exlibrisgroup.com/view/uresolver/43ACC_OEAW/openurl?u.ignore_date_coverage=true&portfolio_pid=5338465170004498&Force_direct=true |Z 5338465170004498 |b Available |8 5338465170004498 | ||