Semiconductor packaging : : materials interaction and reliability / / Andrea Chen, Randy Hsiao-Yu Lo.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
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| Place / Publishing House: | Boca Raton, Fla. : : CRC Press,, 2012. |
| Year of Publication: | 2012 |
| Edition: | 1st edition |
| Language: | English |
| Physical Description: | 1 online resource (208 p.) |
| Notes: | Description based upon print version of record. |
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| DOAB Directory of Open Access Books | Available |