Semiconductor packaging : : materials interaction and reliability / / Andrea Chen, Randy Hsiao-Yu Lo.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
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|---|---|
| Year of Publication: | 2011 |
| Edition: | 1st edition |
| Language: | English |
| Physical Description: | 1 online resource (208 p.) |
| Notes: | Description based upon print version of record. |
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Table of Contents:
- Front Cover; Contents; Preface; Authors; Partial list of abbreviations, acronyms, and symbols; Chapter 1: History and background; Chapter 2: Package form factors and families; Chapter 3: Surface-mount technology; Chapter 4: Other packaging needs; Chapter 5: Reliability testing; Chapter 6: Polymers; Chapter 7: Metals; Chapter 8: Ceramics and glasses; Chapter 9: Trends and challenges; Chapter 10: Light-emitting diodes; Glossary; Appendix A: Analytical tools; Appendix B: Destructive tools and tests; Back Cover