Semiconductor packaging : : materials interaction and reliability / / Andrea Chen, Randy Hsiao-Yu Lo.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
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Year of Publication: | 2011 |
Edition: | 1st edition |
Language: | English |
Physical Description: | 1 online resource (208 p.) |
Notes: | Description based upon print version of record. |
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Electronic
DOAB Directory of Open Access Books | Available |