Failure Analysis : : High Technology Devices / / Daniel J. D. Sullivan, Eric J. Carleton.
The book presents a unique view of failure analysis of high technology devices. It describes capabilities and limitations of many analytical techniques and testing paths and decisions best followed in example failure analysis studies.
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| Superior document: | Title is part of eBook package: De Gruyter DG Plus DeG Package 2022 Part 1 |
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| VerfasserIn: | |
| Place / Publishing House: | Berlin ;, Boston : : De Gruyter, , [2022] ©2022 |
| Year of Publication: | 2022 |
| Language: | English |
| Series: | De Gruyter STEM
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| Online Access: | |
| Physical Description: | 1 online resource (VIII, 120 p.) |
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Table of Contents:
- Frontmatter
- Contents
- Chapter 1 Introduction to FA
- Chapter 2 Why is FA important?
- Chapter 3 Planning out an FA
- Chapter 4 Typical types of failure mechanisms
- Chapter 5 Destructive versus nondestructive analysis
- Chapter 6 Optical Microscopy (OM)
- Chapter 7 Scanning Acoustic Microscopy/Tomography (SAM or SAT)
- Chapter 8 X-ray imaging (2D and 3D)
- Chapter 9 Time Domain Reflectometry (TDR)
- Chapter 10 Selecting the path before destructive analysis begins
- Chapter 11 Destructive work
- Chapter 12 Electrical Failure Analysis (EFA)
- Chapter 13 EMMI/OBIRCH/IR
- Chapter 14 Cross sections (X-sections)
- Chapter 15 Parallel lapping (p-lap)
- Chapter 16 Focused Ion Beam (FIB)
- Chapter 17 Scanning Electron Microscopy (SEM)
- Chapter 18 Transmission Electron Microscopy (TEM)
- Chapter 19 Energy Dispersive X-ray spectroscopy (EDX)
- Chapter 20 Use of additional materials analytical techniques and processes
- Chapter 21 How should these results be used?
- References
- Appendix
- List of figures
- Index