Failure Analysis : : High Technology Devices /

Failure Analysis : : High Technology Devices / / Daniel J. D. Sullivan, Eric J. Carleton.

The book presents a unique view of failure analysis of high technology devices. It describes capabilities and limitations of many analytical techniques and testing paths and decisions best followed in example failure analysis studies.

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Superior document:Title is part of eBook package: De Gruyter DG Plus DeG Package 2022 Part 1
VerfasserIn:
Sullivan, Daniel J. D.,
Carleton, Eric J.,
Place / Publishing House:Berlin ;, Boston : : De Gruyter, , [2022]
©2022
Year of Publication:2022
Language:English
Series:De Gruyter STEM
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Physical Description:1 online resource (VIII, 120 p.)
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id 9781501524790
lccn 2022941691
ctrlnum (DE-B1597)576728
(OCoLC)1350572270
collection bib_alma
record_format marc
spelling Sullivan, Daniel J. D., author. aut http://id.loc.gov/vocabulary/relators/aut
Failure Analysis : High Technology Devices / Daniel J. D. Sullivan, Eric J. Carleton.
Berlin ; Boston : De Gruyter, [2022]
©2022
1 online resource (VIII, 120 p.)
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
text file PDF rda
De Gruyter STEM
Frontmatter -- Contents -- Chapter 1 Introduction to FA -- Chapter 2 Why is FA important? -- Chapter 3 Planning out an FA -- Chapter 4 Typical types of failure mechanisms -- Chapter 5 Destructive versus nondestructive analysis -- Chapter 6 Optical Microscopy (OM) -- Chapter 7 Scanning Acoustic Microscopy/Tomography (SAM or SAT) -- Chapter 8 X-ray imaging (2D and 3D) -- Chapter 9 Time Domain Reflectometry (TDR) -- Chapter 10 Selecting the path before destructive analysis begins -- Chapter 11 Destructive work -- Chapter 12 Electrical Failure Analysis (EFA) -- Chapter 13 EMMI/OBIRCH/IR -- Chapter 14 Cross sections (X-sections) -- Chapter 15 Parallel lapping (p-lap) -- Chapter 16 Focused Ion Beam (FIB) -- Chapter 17 Scanning Electron Microscopy (SEM) -- Chapter 18 Transmission Electron Microscopy (TEM) -- Chapter 19 Energy Dispersive X-ray spectroscopy (EDX) -- Chapter 20 Use of additional materials analytical techniques and processes -- Chapter 21 How should these results be used? -- References -- Appendix -- List of figures -- Index
restricted access http://purl.org/coar/access_right/c_16ec online access with authorization star
The book presents a unique view of failure analysis of high technology devices. It describes capabilities and limitations of many analytical techniques and testing paths and decisions best followed in example failure analysis studies.
Issued also in print.
Mode of access: Internet via World Wide Web.
In English.
Description based on online resource; title from PDF title page (publisher's Web site, viewed 29. Mai 2023)
Technology & Engineering / Materials Science / General. bisacsh
Analytical Techniques.
Failure Analysis.
High Technology Devices.
Carleton, Eric J., author. aut http://id.loc.gov/vocabulary/relators/aut
Title is part of eBook package: De Gruyter DG Plus DeG Package 2022 Part 1 9783110766820
Title is part of eBook package: De Gruyter EBOOK PACKAGE COMPLETE 2022 English 9783110993899
Title is part of eBook package: De Gruyter EBOOK PACKAGE COMPLETE 2022 9783110994810 ZDB-23-DGG
Title is part of eBook package: De Gruyter EBOOK PACKAGE Physics, Chemistry, Mat.Sc, Geosc 2022 English 9783110993448
Title is part of eBook package: De Gruyter EBOOK PACKAGE Physics, Chemistry, Mat.Sc, Geosc 2022 9783110993219 ZDB-23-DPC
EPUB 9781501516474
print 9781501524783
https://doi.org/10.1515/9781501524790
https://www.degruyter.com/isbn/9781501524790
Cover https://www.degruyter.com/document/cover/isbn/9781501524790/original
language English
format eBook
author Sullivan, Daniel J. D.,
Sullivan, Daniel J. D.,
Carleton, Eric J.,
spellingShingle Sullivan, Daniel J. D.,
Sullivan, Daniel J. D.,
Carleton, Eric J.,
Failure Analysis : High Technology Devices /
De Gruyter STEM
Frontmatter --
Contents --
Chapter 1 Introduction to FA --
Chapter 2 Why is FA important? --
Chapter 3 Planning out an FA --
Chapter 4 Typical types of failure mechanisms --
Chapter 5 Destructive versus nondestructive analysis --
Chapter 6 Optical Microscopy (OM) --
Chapter 7 Scanning Acoustic Microscopy/Tomography (SAM or SAT) --
Chapter 8 X-ray imaging (2D and 3D) --
Chapter 9 Time Domain Reflectometry (TDR) --
Chapter 10 Selecting the path before destructive analysis begins --
Chapter 11 Destructive work --
Chapter 12 Electrical Failure Analysis (EFA) --
Chapter 13 EMMI/OBIRCH/IR --
Chapter 14 Cross sections (X-sections) --
Chapter 15 Parallel lapping (p-lap) --
Chapter 16 Focused Ion Beam (FIB) --
Chapter 17 Scanning Electron Microscopy (SEM) --
Chapter 18 Transmission Electron Microscopy (TEM) --
Chapter 19 Energy Dispersive X-ray spectroscopy (EDX) --
Chapter 20 Use of additional materials analytical techniques and processes --
Chapter 21 How should these results be used? --
References --
Appendix --
List of figures --
Index
author_facet Sullivan, Daniel J. D.,
Sullivan, Daniel J. D.,
Carleton, Eric J.,
Carleton, Eric J.,
Carleton, Eric J.,
author_variant d j d s djd djds
d j d s djd djds
e j c ej ejc
author_role VerfasserIn
VerfasserIn
VerfasserIn
author2 Carleton, Eric J.,
Carleton, Eric J.,
author2_variant e j c ej ejc
author2_role VerfasserIn
VerfasserIn
author_sort Sullivan, Daniel J. D.,
title Failure Analysis : High Technology Devices /
title_sub High Technology Devices /
title_full Failure Analysis : High Technology Devices / Daniel J. D. Sullivan, Eric J. Carleton.
title_fullStr Failure Analysis : High Technology Devices / Daniel J. D. Sullivan, Eric J. Carleton.
title_full_unstemmed Failure Analysis : High Technology Devices / Daniel J. D. Sullivan, Eric J. Carleton.
title_auth Failure Analysis : High Technology Devices /
title_alt Frontmatter --
Contents --
Chapter 1 Introduction to FA --
Chapter 2 Why is FA important? --
Chapter 3 Planning out an FA --
Chapter 4 Typical types of failure mechanisms --
Chapter 5 Destructive versus nondestructive analysis --
Chapter 6 Optical Microscopy (OM) --
Chapter 7 Scanning Acoustic Microscopy/Tomography (SAM or SAT) --
Chapter 8 X-ray imaging (2D and 3D) --
Chapter 9 Time Domain Reflectometry (TDR) --
Chapter 10 Selecting the path before destructive analysis begins --
Chapter 11 Destructive work --
Chapter 12 Electrical Failure Analysis (EFA) --
Chapter 13 EMMI/OBIRCH/IR --
Chapter 14 Cross sections (X-sections) --
Chapter 15 Parallel lapping (p-lap) --
Chapter 16 Focused Ion Beam (FIB) --
Chapter 17 Scanning Electron Microscopy (SEM) --
Chapter 18 Transmission Electron Microscopy (TEM) --
Chapter 19 Energy Dispersive X-ray spectroscopy (EDX) --
Chapter 20 Use of additional materials analytical techniques and processes --
Chapter 21 How should these results be used? --
References --
Appendix --
List of figures --
Index
title_new Failure Analysis :
title_sort failure analysis : high technology devices /
series De Gruyter STEM
series2 De Gruyter STEM
publisher De Gruyter,
publishDate 2022
physical 1 online resource (VIII, 120 p.)
Issued also in print.
contents Frontmatter --
Contents --
Chapter 1 Introduction to FA --
Chapter 2 Why is FA important? --
Chapter 3 Planning out an FA --
Chapter 4 Typical types of failure mechanisms --
Chapter 5 Destructive versus nondestructive analysis --
Chapter 6 Optical Microscopy (OM) --
Chapter 7 Scanning Acoustic Microscopy/Tomography (SAM or SAT) --
Chapter 8 X-ray imaging (2D and 3D) --
Chapter 9 Time Domain Reflectometry (TDR) --
Chapter 10 Selecting the path before destructive analysis begins --
Chapter 11 Destructive work --
Chapter 12 Electrical Failure Analysis (EFA) --
Chapter 13 EMMI/OBIRCH/IR --
Chapter 14 Cross sections (X-sections) --
Chapter 15 Parallel lapping (p-lap) --
Chapter 16 Focused Ion Beam (FIB) --
Chapter 17 Scanning Electron Microscopy (SEM) --
Chapter 18 Transmission Electron Microscopy (TEM) --
Chapter 19 Energy Dispersive X-ray spectroscopy (EDX) --
Chapter 20 Use of additional materials analytical techniques and processes --
Chapter 21 How should these results be used? --
References --
Appendix --
List of figures --
Index
isbn 9781501524790
9783110766820
9783110993899
9783110994810
9783110993448
9783110993219
9781501516474
9781501524783
url https://doi.org/10.1515/9781501524790
https://www.degruyter.com/isbn/9781501524790
https://www.degruyter.com/document/cover/isbn/9781501524790/original
illustrated Not Illustrated
dewey-hundreds 600 - Technology
dewey-tens 650 - Management & public relations
dewey-ones 658 - General management
dewey-full 658.57
dewey-sort 3658.57
dewey-raw 658.57
dewey-search 658.57
doi_str_mv 10.1515/9781501524790
oclc_num 1350572270
work_keys_str_mv AT sullivandanieljd failureanalysishightechnologydevices
AT carletonericj failureanalysishightechnologydevices
status_str n
ids_txt_mv (DE-B1597)576728
(OCoLC)1350572270
carrierType_str_mv cr
hierarchy_parent_title Title is part of eBook package: De Gruyter DG Plus DeG Package 2022 Part 1
Title is part of eBook package: De Gruyter EBOOK PACKAGE COMPLETE 2022 English
Title is part of eBook package: De Gruyter EBOOK PACKAGE COMPLETE 2022
Title is part of eBook package: De Gruyter EBOOK PACKAGE Physics, Chemistry, Mat.Sc, Geosc 2022 English
Title is part of eBook package: De Gruyter EBOOK PACKAGE Physics, Chemistry, Mat.Sc, Geosc 2022
is_hierarchy_title Failure Analysis : High Technology Devices /
container_title Title is part of eBook package: De Gruyter DG Plus DeG Package 2022 Part 1
author2_original_writing_str_mv noLinkedField
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