Advances in embedded and fan-out wafer level packaging technologies / / edited by Beth Keser, Ph. D. and Steffen Krohnert.
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| Place / Publishing House: | Hoboken, NJ : : Wiley,, 2019. |
| Year of Publication: | 2019 |
| Language: | English |
| Online Access: | |
| Physical Description: | 1 online resource (xxvii, 548 pages) :; illustrations |
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