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Beth Keser

Beth Keser is an American electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and president of the International Microelectronics and Packaging Society. Provided by Wikipedia

Advances in embedded and fan-out wafer level packaging technologies / / edited by Beth Keser, Ph. D. and Steffen Krohnert.

Participants: Keser, Beth, [ TeilnehmendeR ]; Kroehnert, Steffen, [ TeilnehmendeR ]
Published: 2019.

Other Authors: “...Keser, Beth,...”

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