Advances in embedded and fan-out wafer level packaging technologies / / edited by Beth Keser, Ph. D. and Steffen Krohnert.
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| Place / Publishing House: | Hoboken, NJ : : Wiley,, 2019. |
| Year of Publication: | 2019 |
| Language: | English |
| Online Access: | |
| Physical Description: | 1 online resource (xxvii, 548 pages) :; illustrations |
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| 001 | 5005720829 | ||
| 003 | MiAaPQ | ||
| 005 | 20200520144314.0 | ||
| 006 | m o d | | ||
| 007 | cr cnu|||||||| | ||
| 008 | 190315s2019 njua ob 001 0 eng d | ||
| 020 | |z 9781119314134 | ||
| 020 | |a 9781119313977 |q (electronic bk.) | ||
| 035 | |a (MiAaPQ)5005720829 | ||
| 035 | |a (Au-PeEL)EBL5720829 | ||
| 035 | |a (OCoLC)1089612468 | ||
| 040 | |a MiAaPQ |b eng |e rda |e pn |c MiAaPQ |d MiAaPQ | ||
| 050 | 4 | |a TK7874 |b .A383 2019 | |
| 082 | 0 | |a 621.38173 |2 23 | |
| 245 | 0 | 0 | |a Advances in embedded and fan-out wafer level packaging technologies / |c edited by Beth Keser, Ph. D. and Steffen Krohnert. |
| 264 | 1 | |a Hoboken, NJ : |b Wiley, |c 2019. | |
| 300 | |a 1 online resource (xxvii, 548 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index. | ||
| 588 | |a Description based on print version record. | ||
| 590 | |a Electronic reproduction. Ann Arbor, MI : ProQuest, 2018. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. | ||
| 650 | 0 | |a Integrated circuits. | |
| 650 | 0 | |a Integrated circuits |x Wafer-scale integration. | |
| 650 | 0 | |a Chip scale packaging. | |
| 655 | 4 | |a Electronic books. | |
| 700 | 1 | |a Keser, Beth, |e editor. | |
| 700 | 1 | |a Kroehnert, Steffen, |e editor. | |
| 776 | 0 | 8 | |i Print version: |t Advances in embedded and fan-out wafer level packaging technologies. |d Hoboken, NJ : Wiley, 2019 |h xxvii, 548 pages |z 9781119314134 |
| 797 | 2 | |a ProQuest (Firm) | |
| 856 | 4 | 0 | |u https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=5720829 |z Click to View |