Advances in embedded and fan-out wafer level packaging technologies /

Advances in embedded and fan-out wafer level packaging technologies / / edited by Beth Keser, Ph. D. and Steffen Krohnert.

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TeilnehmendeR:
Keser, Beth,
Kroehnert, Steffen,
Place / Publishing House:Hoboken, NJ : : Wiley,, 2019.
Year of Publication:2019
Language:English
Online Access:
Physical Description:1 online resource (xxvii, 548 pages) :; illustrations
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(OCoLC)1089612468
collection bib_alma
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spelling Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser, Ph. D. and Steffen Krohnert.
Hoboken, NJ : Wiley, 2019.
1 online resource (xxvii, 548 pages) : illustrations
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Includes bibliographical references and index.
Description based on print version record.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2018. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Integrated circuits.
Integrated circuits Wafer-scale integration.
Chip scale packaging.
Electronic books.
Keser, Beth, editor.
Kroehnert, Steffen, editor.
Print version: Advances in embedded and fan-out wafer level packaging technologies. Hoboken, NJ : Wiley, 2019 xxvii, 548 pages 9781119314134
ProQuest (Firm)
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=5720829 Click to View
language English
format eBook
author2 Keser, Beth,
Kroehnert, Steffen,
author_facet Keser, Beth,
Kroehnert, Steffen,
author2_variant b k bk
s k sk
author2_role TeilnehmendeR
TeilnehmendeR
title Advances in embedded and fan-out wafer level packaging technologies /
spellingShingle Advances in embedded and fan-out wafer level packaging technologies /
title_full Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser, Ph. D. and Steffen Krohnert.
title_fullStr Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser, Ph. D. and Steffen Krohnert.
title_full_unstemmed Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser, Ph. D. and Steffen Krohnert.
title_auth Advances in embedded and fan-out wafer level packaging technologies /
title_new Advances in embedded and fan-out wafer level packaging technologies /
title_sort advances in embedded and fan-out wafer level packaging technologies /
publisher Wiley,
publishDate 2019
physical 1 online resource (xxvii, 548 pages) : illustrations
isbn 9781119313977
9781119314134
callnumber-first T - Technology
callnumber-subject TK - Electrical and Nuclear Engineering
callnumber-label TK7874
callnumber-sort TK 47874 A383 42019
genre Electronic books.
genre_facet Electronic books.
url https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=5720829
illustrated Illustrated
dewey-hundreds 600 - Technology
dewey-tens 620 - Engineering
dewey-ones 621 - Applied physics
dewey-full 621.38173
dewey-sort 3621.38173
dewey-raw 621.38173
dewey-search 621.38173
oclc_num 1089612468
work_keys_str_mv AT keserbeth advancesinembeddedandfanoutwaferlevelpackagingtechnologies
AT kroehnertsteffen advancesinembeddedandfanoutwaferlevelpackagingtechnologies
status_str n
ids_txt_mv (MiAaPQ)5005720829
(Au-PeEL)EBL5720829
(OCoLC)1089612468
carrierType_str_mv cr
is_hierarchy_title Advances in embedded and fan-out wafer level packaging technologies /
author2_original_writing_str_mv noLinkedField
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