Design and modeling for 3D ICs and interposers /

Design and modeling for 3D ICs and interposers / / Madhavan Swaminathan, Ki Jin Han.

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Superior document:WSPC series in advanced integration and packaging ; volume 2
:
Swaminathan, Madhavan.
TeilnehmendeR:
Han, Ki Jin.
Place / Publishing House:Singapore ;, Hackensack, New Jersey : : World Scientific Publishing Company,, [2014]
2014
Year of Publication:2014
Language:English
Series:WSPC series in advanced integration and packaging ; v. 2.
Online Access:
Physical Description:1 online resource (379 pages) :; illustrations
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(CaPaEBR)ebr10813527
(CaONFJC)MIL549566
(OCoLC)864743706
collection bib_alma
record_format marc
spelling Swaminathan, Madhavan.
Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Ki Jin Han.
Singapore ; Hackensack, New Jersey : World Scientific Publishing Company, [2014]
2014
1 online resource (379 pages) : illustrations
text rdacontent
computer rdamedia
online resource rdacarrier
WSPC series in advanced integration and packaging ; volume 2
Includes bibliographical references and index.
Description based on online resource; title from PDF (ebrary, viewed December 30, 2013).
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Integrators.
Systems integration.
Electronic books.
Han, Ki Jin.
ProQuest (Firm)
WSPC series in advanced integration and packaging ; v. 2.
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1578321 Click to View
language English
format eBook
author Swaminathan, Madhavan.
spellingShingle Swaminathan, Madhavan.
Design and modeling for 3D ICs and interposers /
WSPC series in advanced integration and packaging ;
author_facet Swaminathan, Madhavan.
Han, Ki Jin.
author_variant m s ms
author2 Han, Ki Jin.
author2_variant k j h kj kjh
author2_role TeilnehmendeR
author_sort Swaminathan, Madhavan.
title Design and modeling for 3D ICs and interposers /
title_full Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Ki Jin Han.
title_fullStr Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Ki Jin Han.
title_full_unstemmed Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Ki Jin Han.
title_auth Design and modeling for 3D ICs and interposers /
title_new Design and modeling for 3D ICs and interposers /
title_sort design and modeling for 3d ics and interposers /
series WSPC series in advanced integration and packaging ;
series2 WSPC series in advanced integration and packaging ;
publisher World Scientific Publishing Company,
publishDate 2014
physical 1 online resource (379 pages) : illustrations
isbn 9789814508605
callnumber-first T - Technology
callnumber-subject TA - General and Civil Engineering
callnumber-label TA168
callnumber-sort TA 3168 S93 42014
genre Electronic books.
genre_facet Electronic books.
url https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1578321
illustrated Illustrated
oclc_num 864743706
work_keys_str_mv AT swaminathanmadhavan designandmodelingfor3dicsandinterposers
AT hankijin designandmodelingfor3dicsandinterposers
status_str n
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(OCoLC)864743706
hierarchy_parent_title WSPC series in advanced integration and packaging ; volume 2
hierarchy_sequence v. 2.
is_hierarchy_title Design and modeling for 3D ICs and interposers /
container_title WSPC series in advanced integration and packaging ; volume 2
author2_original_writing_str_mv noLinkedField
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