Design and modeling for 3D ICs and interposers / / Madhavan Swaminathan, Ki Jin Han.
Saved in:
| Superior document: | WSPC series in advanced integration and packaging ; volume 2 |
|---|---|
| : | |
| TeilnehmendeR: | |
| Place / Publishing House: | Singapore ;, Hackensack, New Jersey : : World Scientific Publishing Company,, [2014] 2014 |
| Year of Publication: | 2014 |
| Language: | English |
| Series: | WSPC series in advanced integration and packaging ;
v. 2. |
| Online Access: | |
| Physical Description: | 1 online resource (379 pages) :; illustrations |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 01728nam a22004331i 4500 | ||
|---|---|---|---|
| 001 | 5001578321 | ||
| 003 | MiAaPQ | ||
| 005 | 20200520144314.0 | ||
| 006 | m o d | | ||
| 007 | cr cnu|||||||| | ||
| 008 | 131230t20142014si a ob 001 0 eng d | ||
| 020 | |z 9789814508599 | ||
| 020 | |a 9789814508605 |q (electronic bk.) | ||
| 035 | |a (MiAaPQ)5001578321 | ||
| 035 | |a (Au-PeEL)EBL1578321 | ||
| 035 | |a (CaPaEBR)ebr10813527 | ||
| 035 | |a (CaONFJC)MIL549566 | ||
| 035 | |a (OCoLC)864743706 | ||
| 040 | |a MiAaPQ |b eng |e rda |e pn |c MiAaPQ |d MiAaPQ | ||
| 050 | 4 | |a TA168 |b .S93 2014 | |
| 100 | 1 | |a Swaminathan, Madhavan. | |
| 245 | 1 | 0 | |a Design and modeling for 3D ICs and interposers / |c Madhavan Swaminathan, Ki Jin Han. |
| 264 | 1 | |a Singapore ; |a Hackensack, New Jersey : |b World Scientific Publishing Company, |c [2014] | |
| 264 | 4 | |c 2014 | |
| 300 | |a 1 online resource (379 pages) : |b illustrations | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a computer |2 rdamedia | ||
| 338 | |a online resource |2 rdacarrier | ||
| 490 | 1 | |a WSPC series in advanced integration and packaging ; |v volume 2 | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | |a Description based on online resource; title from PDF (ebrary, viewed December 30, 2013). | ||
| 590 | |a Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. | ||
| 650 | 0 | |a Integrators. | |
| 650 | 0 | |a Systems integration. | |
| 655 | 4 | |a Electronic books. | |
| 700 | 1 | |a Han, Ki Jin. | |
| 797 | 2 | |a ProQuest (Firm) | |
| 830 | 0 | |a WSPC series in advanced integration and packaging ; |v v. 2. | |
| 856 | 4 | 0 | |u https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1578321 |z Click to View |