Design and modeling for 3D ICs and interposers / / Madhavan Swaminathan, Ki Jin Han.
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| Superior document: | WSPC series in advanced integration and packaging ; volume 2 |
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| TeilnehmendeR: | |
| Place / Publishing House: | Singapore ;, Hackensack, New Jersey : : World Scientific Publishing Company,, [2014] 2014 |
| Year of Publication: | 2014 |
| Language: | English |
| Series: | WSPC series in advanced integration and packaging ;
v. 2. |
| Online Access: | |
| Physical Description: | 1 online resource (379 pages) :; illustrations |
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| Bibliography: | Includes bibliographical references and index. |
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| ISBN: | 9789814508599 9789814508605 |
| Hierarchical level: | Monograph |
| Statement of Responsibility: | Madhavan Swaminathan, Ki Jin Han. |