Design and modeling for 3D ICs and interposers / / Madhavan Swaminathan, Ki Jin Han.
Saved in:
Superior document: | WSPC series in advanced integration and packaging ; volume 2 |
---|---|
: | |
TeilnehmendeR: | |
Place / Publishing House: | Singapore ;, Hackensack, New Jersey : : World Scientific Publishing Company,, [2014] 2014 |
Year of Publication: | 2014 |
Language: | English |
Series: | WSPC series in advanced integration and packaging ;
v. 2. |
Online Access: | |
Physical Description: | 1 online resource (379 pages) :; illustrations |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Bibliography: | Includes bibliographical references and index. |
---|---|
ISBN: | 9789814508599 9789814508605 |
Hierarchical level: | Monograph |
Statement of Responsibility: | Madhavan Swaminathan, Ki Jin Han. |