Design and modeling for 3D ICs and interposers / / Madhavan Swaminathan, Ki Jin Han.
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Superior document: | WSPC series in advanced integration and packaging ; volume 2 |
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TeilnehmendeR: | |
Place / Publishing House: | Singapore ;, Hackensack, New Jersey : : World Scientific Publishing Company,, [2014] 2014 |
Year of Publication: | 2014 |
Language: | English |
Series: | WSPC series in advanced integration and packaging ;
v. 2. |
Online Access: | |
Physical Description: | 1 online resource (379 pages) :; illustrations |
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