Handbook of 3D integration. / Volume 3, : 3D process technology / / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors.
Saved in:
| TeilnehmendeR: | |
|---|---|
| Place / Publishing House: | Weinheim, Germany : : Wiley-VCH,, 2014. 2014 |
| Year of Publication: | 2014 |
| Language: | English |
| Online Access: | |
| Physical Description: | 1 online resource (475 pages) :; illustrations (some color) |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| id |
5001680609 |
|---|---|
| ctrlnum |
(MiAaPQ)5001680609 (Au-PeEL)EBL1680609 (CaPaEBR)ebr10865387 (CaONFJC)MIL601769 (OCoLC)878919955 |
| collection |
bib_alma |
| record_format |
marc |
| spelling |
Handbook of 3D integration. Volume 3, 3D process technology / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors. Weinheim, Germany : Wiley-VCH, 2014. 2014 1 online resource (475 pages) : illustrations (some color) text rdacontent computer rdamedia online resource rdacarrier Includes bibliographical references at the end of each chapters and index. Description based on online resource; title from PDF title page (ebrary, viewed May 5, 2014). Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. Integrated circuits. Integrated circuits Design and construction. Silicon. Three-dimensional imaging. Electronic books. Garrou, Philip, editor. Koyanagi, Mitsumasa, editor. Ramm, Peter, editor. Allen, Ricky, contributor. Print version: Handbook of 3D integration. Volume 3, 3D process technology. Weinheim, Germany : Wiley-VCH, c2014 xxii, 451 pages 9783527334667 ProQuest (Firm) https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1680609 Click to View |
| language |
English |
| format |
eBook |
| author2 |
Garrou, Philip, Koyanagi, Mitsumasa, Ramm, Peter, Allen, Ricky, |
| author_facet |
Garrou, Philip, Koyanagi, Mitsumasa, Ramm, Peter, Allen, Ricky, |
| author2_variant |
p g pg m k mk p r pr r a ra |
| author2_role |
TeilnehmendeR TeilnehmendeR TeilnehmendeR TeilnehmendeR |
| title |
Handbook of 3D integration. |
| spellingShingle |
Handbook of 3D integration. |
| title_full |
Handbook of 3D integration. Volume 3, 3D process technology / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors. |
| title_fullStr |
Handbook of 3D integration. Volume 3, 3D process technology / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors. |
| title_full_unstemmed |
Handbook of 3D integration. Volume 3, 3D process technology / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors. |
| title_auth |
Handbook of 3D integration. |
| title_new |
Handbook of 3D integration. |
| title_sort |
handbook of 3d integration. 3d process technology / |
| publisher |
Wiley-VCH, |
| publishDate |
2014 |
| physical |
1 online resource (475 pages) : illustrations (some color) |
| isbn |
9783527670130 9783527670123 9783527670116 9783527670109 9783527334667 |
| callnumber-first |
T - Technology |
| callnumber-subject |
TK - Electrical and Nuclear Engineering |
| callnumber-label |
TK7874 |
| callnumber-sort |
TK 47874 H363 42014 |
| genre |
Electronic books. |
| genre_facet |
Electronic books. |
| url |
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1680609 |
| illustrated |
Illustrated |
| dewey-hundreds |
600 - Technology |
| dewey-tens |
620 - Engineering |
| dewey-ones |
621 - Applied physics |
| dewey-full |
621.3815 |
| dewey-sort |
3621.3815 |
| dewey-raw |
621.3815 |
| dewey-search |
621.3815 |
| oclc_num |
878919955 |
| work_keys_str_mv |
AT garrouphilip handbookof3dintegrationvolume3 AT koyanagimitsumasa handbookof3dintegrationvolume3 AT rammpeter handbookof3dintegrationvolume3 AT allenricky handbookof3dintegrationvolume3 |
| status_str |
n |
| ids_txt_mv |
(MiAaPQ)5001680609 (Au-PeEL)EBL1680609 (CaPaEBR)ebr10865387 (CaONFJC)MIL601769 (OCoLC)878919955 |
| title_part_txt |
3D process technology / |
| is_hierarchy_title |
Handbook of 3D integration. |
| author2_original_writing_str_mv |
noLinkedField noLinkedField noLinkedField noLinkedField |
| _version_ |
1792330777827999745 |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02212nam a2200517 i 4500</leader><controlfield tag="001">5001680609</controlfield><controlfield tag="003">MiAaPQ</controlfield><controlfield tag="005">20200520144314.0</controlfield><controlfield tag="006">m o d | </controlfield><controlfield tag="007">cr cnu||||||||</controlfield><controlfield tag="008">140506t20142014gw a ob 001 0 eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9783527334667</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527670130</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527670123</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527670116</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527670109</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(MiAaPQ)5001680609</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(Au-PeEL)EBL1680609</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CaPaEBR)ebr10865387</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CaONFJC)MIL601769</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)878919955</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">MiAaPQ</subfield><subfield code="b">eng</subfield><subfield code="e">rda</subfield><subfield code="e">pn</subfield><subfield code="c">MiAaPQ</subfield><subfield code="d">MiAaPQ</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TK7874</subfield><subfield code="b">.H363 2014</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="0" ind2="0"><subfield code="a">Handbook of 3D integration.</subfield><subfield code="n">Volume 3,</subfield><subfield code="p">3D process technology /</subfield><subfield code="c">edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Weinheim, Germany :</subfield><subfield code="b">Wiley-VCH,</subfield><subfield code="c">2014.</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (475 pages) :</subfield><subfield code="b">illustrations (some color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references at the end of each chapters and index.</subfield></datafield><datafield tag="588" ind1=" " ind2=" "><subfield code="a">Description based on online resource; title from PDF title page (ebrary, viewed May 5, 2014).</subfield></datafield><datafield tag="590" ind1=" " ind2=" "><subfield code="a">Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Integrated circuits.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Integrated circuits</subfield><subfield code="x">Design and construction.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Silicon.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Three-dimensional imaging.</subfield></datafield><datafield tag="655" ind1=" " ind2="4"><subfield code="a">Electronic books.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Garrou, Philip,</subfield><subfield code="e">editor.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Koyanagi, Mitsumasa,</subfield><subfield code="e">editor.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ramm, Peter,</subfield><subfield code="e">editor.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Allen, Ricky,</subfield><subfield code="e">contributor.</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="t">Handbook of 3D integration. Volume 3, 3D process technology.</subfield><subfield code="d">Weinheim, Germany : Wiley-VCH, c2014 </subfield><subfield code="h">xxii, 451 pages </subfield><subfield code="z">9783527334667</subfield></datafield><datafield tag="797" ind1="2" ind2=" "><subfield code="a">ProQuest (Firm)</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1680609</subfield><subfield code="z">Click to View</subfield></datafield></record></collection> |