MEMS Packaging Technologies and 3D Integration

MEMS Packaging Technologies and 3D Integration

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers...

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Sonstige:
Seok, Seonho
Year of Publication:2022
Language:English
Physical Description:1 electronic resource (210 p.)
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id 993544427904498
ctrlnum (CKB)5720000000008413
(oapen)https://directory.doabooks.org/handle/20.500.12854/84576
(EXLCZ)995720000000008413
collection bib_alma
record_format marc
spelling Seok, Seonho edt
MEMS Packaging Technologies and 3D Integration
MDPI - Multidisciplinary Digital Publishing Institute 2022
1 electronic resource (210 p.)
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
English
Research & information: general bicssc
Biology, life sciences bicssc
heterogeneous integration
wafer bonding
wafer sealing
room-temperature bonding
Au-Au bonding
surface activated bonding
Au film thickness
surface roughness
microelectromechanical systems (MEMS) packaging
inkjet printing
redistribution layers
capacitive micromachined ultrasound transducers (CMUT)
fan-out wafer-level packaging (FOWLP)
adhesion
thin film metal
parylene
neural probe
scotch tape test
FEM
MEMS resonator
temperature coefficient
thermal stress
millimeter-wave
redundant TSV
equivalent circuit model
S-parameters extraction
technology evaluation
MEMS and IC integration
MCDM
fuzzy AHP
fuzzy VIKOR
fan-out wafer-level package
finite element
glass substrate
reliability life
packaging-on-packaging
thermal sensors
TMOS sensor
finite difference time domain
optical and electromagnetics simulations
finite element analysis
ultrasonic bonding
metal direct bonding
microsystem integration
biocompatible packaging
implantable
reliability
Finite element method (FEM)
simulation
multilayer reactive bonding
integrated nanostructure-multilayer reactive system
spontaneous self-ignition
self-propagating exothermic reaction
Pd/Al reactive multilayer system
Ni/Al reactive multilayer system
low-temperature MEMS packaging
crack propagation
microbump
deflection angle
stress intensity factor (SIF)
polymer packaging
neural interface
chronic implantation
3-0365-4258-2
3-0365-4257-4
Seok, Seonho oth
language English
format eBook
author2 Seok, Seonho
author_facet Seok, Seonho
author2_variant s s ss
author2_role Sonstige
title MEMS Packaging Technologies and 3D Integration
spellingShingle MEMS Packaging Technologies and 3D Integration
title_full MEMS Packaging Technologies and 3D Integration
title_fullStr MEMS Packaging Technologies and 3D Integration
title_full_unstemmed MEMS Packaging Technologies and 3D Integration
title_auth MEMS Packaging Technologies and 3D Integration
title_new MEMS Packaging Technologies and 3D Integration
title_sort mems packaging technologies and 3d integration
publisher MDPI - Multidisciplinary Digital Publishing Institute
publishDate 2022
physical 1 electronic resource (210 p.)
isbn 3-0365-4258-2
3-0365-4257-4
illustrated Not Illustrated
work_keys_str_mv AT seokseonho memspackagingtechnologiesand3dintegration
status_str n
ids_txt_mv (CKB)5720000000008413
(oapen)https://directory.doabooks.org/handle/20.500.12854/84576
(EXLCZ)995720000000008413
carrierType_str_mv cr
is_hierarchy_title MEMS Packaging Technologies and 3D Integration
author2_original_writing_str_mv noLinkedField
_version_ 1796652272588947456
fullrecord <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03626nam-a2201057z--4500</leader><controlfield tag="001">993544427904498</controlfield><controlfield tag="005">20231214132818.0</controlfield><controlfield tag="006">m o d </controlfield><controlfield tag="007">cr|mn|---annan</controlfield><controlfield tag="008">202206s2022 xx |||||o ||| 0|eng d</controlfield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CKB)5720000000008413</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(oapen)https://directory.doabooks.org/handle/20.500.12854/84576</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(EXLCZ)995720000000008413</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Seok, Seonho</subfield><subfield code="4">edt</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">MEMS Packaging Technologies and 3D Integration</subfield></datafield><datafield tag="260" ind1=" " ind2=" "><subfield code="b">MDPI - Multidisciplinary Digital Publishing Institute</subfield><subfield code="c">2022</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 electronic resource (210 p.)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.</subfield></datafield><datafield tag="546" ind1=" " ind2=" "><subfield code="a">English</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Research &amp; information: general</subfield><subfield code="2">bicssc</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Biology, life sciences</subfield><subfield code="2">bicssc</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">heterogeneous integration</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">wafer bonding</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">wafer sealing</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">room-temperature bonding</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Au-Au bonding</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">surface activated bonding</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Au film thickness</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">surface roughness</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">microelectromechanical systems (MEMS) packaging</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">inkjet printing</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">redistribution layers</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">capacitive micromachined ultrasound transducers (CMUT)</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">fan-out wafer-level packaging (FOWLP)</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">adhesion</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">thin film metal</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">parylene</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">neural probe</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">scotch tape test</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">FEM</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">MEMS resonator</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">temperature coefficient</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">thermal stress</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">millimeter-wave</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">redundant TSV</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">equivalent circuit model</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">S-parameters extraction</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">technology evaluation</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">MEMS and IC integration</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">MCDM</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">fuzzy AHP</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">fuzzy VIKOR</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">fan-out wafer-level package</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">finite element</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">glass substrate</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">reliability life</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">packaging-on-packaging</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">thermal sensors</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">TMOS sensor</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">finite difference time domain</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">optical and electromagnetics simulations</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">finite element analysis</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">ultrasonic bonding</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">metal direct bonding</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">microsystem integration</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">biocompatible packaging</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">implantable</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">reliability</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Finite element method (FEM)</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">simulation</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">multilayer reactive bonding</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">integrated nanostructure-multilayer reactive system</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">spontaneous self-ignition</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">self-propagating exothermic reaction</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Pd/Al reactive multilayer system</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Ni/Al reactive multilayer system</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">low-temperature MEMS packaging</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">crack propagation</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">microbump</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">deflection angle</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">stress intensity factor (SIF)</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">polymer packaging</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">neural interface</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">chronic implantation</subfield></datafield><datafield tag="776" ind1=" " ind2=" "><subfield code="z">3-0365-4258-2</subfield></datafield><datafield tag="776" ind1=" " ind2=" "><subfield code="z">3-0365-4257-4</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Seok, Seonho</subfield><subfield code="4">oth</subfield></datafield><datafield tag="906" ind1=" " ind2=" "><subfield code="a">BOOK</subfield></datafield><datafield tag="ADM" ind1=" " ind2=" "><subfield code="b">2023-12-15 05:31:23 Europe/Vienna</subfield><subfield code="f">system</subfield><subfield code="c">marc21</subfield><subfield code="a">2022-07-02 22:45:44 Europe/Vienna</subfield><subfield code="g">false</subfield></datafield><datafield tag="AVE" ind1=" " ind2=" "><subfield code="i">DOAB Directory of Open Access Books</subfield><subfield code="P">DOAB Directory of Open Access Books</subfield><subfield code="x">https://eu02.alma.exlibrisgroup.com/view/uresolver/43ACC_OEAW/openurl?u.ignore_date_coverage=true&amp;portfolio_pid=5337640930004498&amp;Force_direct=true</subfield><subfield code="Z">5337640930004498</subfield><subfield code="b">Available</subfield><subfield code="8">5337640930004498</subfield></datafield></record></collection>

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