MEMS Packaging Technologies and 3D Integration
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers...
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| Year of Publication: | 2022 |
| Language: | English |
| Physical Description: | 1 electronic resource (210 p.) |
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| Summary: | This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation. |
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| Hierarchical level: | Monograph |