MEMS Packaging Technologies and 3D Integration
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers...
Saved in:
| Sonstige: | |
|---|---|
| Year of Publication: | 2022 |
| Language: | English |
| Physical Description: | 1 electronic resource (210 p.) |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 03626nam-a2201057z--4500 | ||
|---|---|---|---|
| 001 | 993544427904498 | ||
| 005 | 20231214132818.0 | ||
| 006 | m o d | ||
| 007 | cr|mn|---annan | ||
| 008 | 202206s2022 xx |||||o ||| 0|eng d | ||
| 035 | |a (CKB)5720000000008413 | ||
| 035 | |a (oapen)https://directory.doabooks.org/handle/20.500.12854/84576 | ||
| 035 | |a (EXLCZ)995720000000008413 | ||
| 041 | 0 | |a eng | |
| 100 | 1 | |a Seok, Seonho |4 edt | |
| 245 | 1 | 0 | |a MEMS Packaging Technologies and 3D Integration |
| 260 | |b MDPI - Multidisciplinary Digital Publishing Institute |c 2022 | ||
| 300 | |a 1 electronic resource (210 p.) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 520 | |a This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation. | ||
| 546 | |a English | ||
| 650 | 7 | |a Research & information: general |2 bicssc | |
| 650 | 7 | |a Biology, life sciences |2 bicssc | |
| 653 | |a heterogeneous integration | ||
| 653 | |a wafer bonding | ||
| 653 | |a wafer sealing | ||
| 653 | |a room-temperature bonding | ||
| 653 | |a Au-Au bonding | ||
| 653 | |a surface activated bonding | ||
| 653 | |a Au film thickness | ||
| 653 | |a surface roughness | ||
| 653 | |a microelectromechanical systems (MEMS) packaging | ||
| 653 | |a inkjet printing | ||
| 653 | |a redistribution layers | ||
| 653 | |a capacitive micromachined ultrasound transducers (CMUT) | ||
| 653 | |a fan-out wafer-level packaging (FOWLP) | ||
| 653 | |a adhesion | ||
| 653 | |a thin film metal | ||
| 653 | |a parylene | ||
| 653 | |a neural probe | ||
| 653 | |a scotch tape test | ||
| 653 | |a FEM | ||
| 653 | |a MEMS resonator | ||
| 653 | |a temperature coefficient | ||
| 653 | |a thermal stress | ||
| 653 | |a millimeter-wave | ||
| 653 | |a redundant TSV | ||
| 653 | |a equivalent circuit model | ||
| 653 | |a S-parameters extraction | ||
| 653 | |a technology evaluation | ||
| 653 | |a MEMS and IC integration | ||
| 653 | |a MCDM | ||
| 653 | |a fuzzy AHP | ||
| 653 | |a fuzzy VIKOR | ||
| 653 | |a fan-out wafer-level package | ||
| 653 | |a finite element | ||
| 653 | |a glass substrate | ||
| 653 | |a reliability life | ||
| 653 | |a packaging-on-packaging | ||
| 653 | |a thermal sensors | ||
| 653 | |a TMOS sensor | ||
| 653 | |a finite difference time domain | ||
| 653 | |a optical and electromagnetics simulations | ||
| 653 | |a finite element analysis | ||
| 653 | |a ultrasonic bonding | ||
| 653 | |a metal direct bonding | ||
| 653 | |a microsystem integration | ||
| 653 | |a biocompatible packaging | ||
| 653 | |a implantable | ||
| 653 | |a reliability | ||
| 653 | |a Finite element method (FEM) | ||
| 653 | |a simulation | ||
| 653 | |a multilayer reactive bonding | ||
| 653 | |a integrated nanostructure-multilayer reactive system | ||
| 653 | |a spontaneous self-ignition | ||
| 653 | |a self-propagating exothermic reaction | ||
| 653 | |a Pd/Al reactive multilayer system | ||
| 653 | |a Ni/Al reactive multilayer system | ||
| 653 | |a low-temperature MEMS packaging | ||
| 653 | |a crack propagation | ||
| 653 | |a microbump | ||
| 653 | |a deflection angle | ||
| 653 | |a stress intensity factor (SIF) | ||
| 653 | |a polymer packaging | ||
| 653 | |a neural interface | ||
| 653 | |a chronic implantation | ||
| 776 | |z 3-0365-4258-2 | ||
| 776 | |z 3-0365-4257-4 | ||
| 700 | 1 | |a Seok, Seonho |4 oth | |
| 906 | |a BOOK | ||
| ADM | |b 2023-12-15 05:31:23 Europe/Vienna |f system |c marc21 |a 2022-07-02 22:45:44 Europe/Vienna |g false | ||
| AVE | |i DOAB Directory of Open Access Books |P DOAB Directory of Open Access Books |x https://eu02.alma.exlibrisgroup.com/view/uresolver/43ACC_OEAW/openurl?u.ignore_date_coverage=true&portfolio_pid=5337640930004498&Force_direct=true |Z 5337640930004498 |b Available |8 5337640930004498 | ||