Electromigration in ULSI interconnections

Electromigration in ULSI interconnections / Cher Ming Tan.

Saved in:
Bibliographic Details
Superior document:International series on advances in solid state electronics and technology (ASSET)
:
ProQuest (Firm)
Tan, Cher Ming, 1959-
TeilnehmendeR:
ProQuest (Firm)
Year of Publication:2010
Language:English
Series:International series on advances in solid state electronics and technology.
Online Access:
Physical Description:xix, 291 p. :; ill. (some col.), col. port.
Tags: Add Tag
No Tags, Be the first to tag this record!
id 500731200
ctrlnum (MiAaPQ)500731200
(Au-PeEL)EBL731200
(CaPaEBR)ebr10480052
(CaONFJC)MIL314371
(OCoLC)714877548
collection bib_alma
fullrecord <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01534nam a2200385 a 4500</leader><controlfield tag="001">500731200</controlfield><controlfield tag="003">MiAaPQ</controlfield><controlfield tag="005">20200520144314.0</controlfield><controlfield tag="006">m o d | </controlfield><controlfield tag="007">cr cn|||||||||</controlfield><controlfield tag="008">110308s2010 njuac sb 001 0 eng d</controlfield><datafield tag="010" ind1=" " ind2=" "><subfield code="z"> 2011280775</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9814273325</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9789814273329</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789814273336 (electronic bk.)</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(MiAaPQ)500731200</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(Au-PeEL)EBL731200</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CaPaEBR)ebr10480052</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CaONFJC)MIL314371</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)714877548</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">MiAaPQ</subfield><subfield code="c">MiAaPQ</subfield><subfield code="d">MiAaPQ</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TK7874.76</subfield><subfield code="b">.T36 2010</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Tan, Cher Ming,</subfield><subfield code="d">1959-</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Electromigration in ULSI interconnections</subfield><subfield code="h">[electronic resource] /</subfield><subfield code="c">Cher Ming Tan.</subfield></datafield><datafield tag="260" ind1=" " ind2=" "><subfield code="a">Hackensack, N.J. :</subfield><subfield code="b">World Scientific,</subfield><subfield code="c">c2010.</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xix, 291 p. :</subfield><subfield code="b">ill. (some col.), col. port.</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">International series on advances in solid state electronics and technology (ASSET)</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index.</subfield></datafield><datafield tag="533" ind1=" " ind2=" "><subfield code="a">Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Integrated circuits</subfield><subfield code="x">Ultra large scale integration.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Electrodiffusion.</subfield></datafield><datafield tag="655" ind1=" " ind2="4"><subfield code="a">Electronic books.</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">ProQuest (Firm)</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">International series on advances in solid state electronics and technology.</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=731200</subfield><subfield code="z">Click to View</subfield></datafield></record></collection>
record_format marc
spelling Tan, Cher Ming, 1959-
Electromigration in ULSI interconnections [electronic resource] / Cher Ming Tan.
Hackensack, N.J. : World Scientific, c2010.
xix, 291 p. : ill. (some col.), col. port.
International series on advances in solid state electronics and technology (ASSET)
Includes bibliographical references and index.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Integrated circuits Ultra large scale integration.
Electrodiffusion.
Electronic books.
ProQuest (Firm)
International series on advances in solid state electronics and technology.
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=731200 Click to View
language English
format Electronic
eBook
author Tan, Cher Ming, 1959-
spellingShingle Tan, Cher Ming, 1959-
Electromigration in ULSI interconnections
International series on advances in solid state electronics and technology (ASSET)
author_facet Tan, Cher Ming, 1959-
ProQuest (Firm)
ProQuest (Firm)
author_variant c m t cm cmt
author2 ProQuest (Firm)
author2_role TeilnehmendeR
author_corporate ProQuest (Firm)
author_sort Tan, Cher Ming, 1959-
title Electromigration in ULSI interconnections
title_full Electromigration in ULSI interconnections [electronic resource] / Cher Ming Tan.
title_fullStr Electromigration in ULSI interconnections [electronic resource] / Cher Ming Tan.
title_full_unstemmed Electromigration in ULSI interconnections [electronic resource] / Cher Ming Tan.
title_auth Electromigration in ULSI interconnections
title_new Electromigration in ULSI interconnections
title_sort electromigration in ulsi interconnections
series International series on advances in solid state electronics and technology (ASSET)
series2 International series on advances in solid state electronics and technology (ASSET)
publisher World Scientific,
publishDate 2010
physical xix, 291 p. : ill. (some col.), col. port.
isbn 9789814273336 (electronic bk.)
callnumber-first T - Technology
callnumber-subject TK - Electrical and Nuclear Engineering
callnumber-label TK7874
callnumber-sort TK 47874.76 T36 42010
genre Electronic books.
genre_facet Electronic books.
url https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=731200
illustrated Illustrated
oclc_num 714877548
work_keys_str_mv AT tancherming electromigrationinulsiinterconnections
AT proquestfirm electromigrationinulsiinterconnections
status_str n
ids_txt_mv (MiAaPQ)500731200
(Au-PeEL)EBL731200
(CaPaEBR)ebr10480052
(CaONFJC)MIL314371
(OCoLC)714877548
hierarchy_parent_title International series on advances in solid state electronics and technology (ASSET)
is_hierarchy_title Electromigration in ULSI interconnections
container_title International series on advances in solid state electronics and technology (ASSET)
author2_original_writing_str_mv noLinkedField
_version_ 1792330716579627008

Similar Items