Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging / guest editors Christopher Bailey and Johan Liu.
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| TeilnehmendeR: | |
| Year of Publication: | 2006 |
| Language: | English |
| Series: | Soldering & surface mount technology ;
v.18, no. 2 |
| Online Access: | |
| Physical Description: | 72 p. |
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