Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging / guest editors Christopher Bailey and Johan Liu.

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ProQuest (Firm)
TeilnehmendeR:
Bailey, Christopher.
Liu, Johan.
ProQuest (Firm)
Year of Publication:2006
Language:English
Series:Soldering & surface mount technology ; v.18, no. 2
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Physical Description:72 p.
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spelling Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
Bradford, England : Emerald Group Publishing, c2006.
72 p.
Soldering & surface mount technology ; v.18, no. 2
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Manufacturing processes.
Electronic packaging.
Electronic books.
Bailey, Christopher.
Liu, Johan.
ProQuest (Firm)
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=267393 Click to View
language English
format Electronic
eBook
author2 Bailey, Christopher.
Liu, Johan.
ProQuest (Firm)
author_facet Bailey, Christopher.
Liu, Johan.
ProQuest (Firm)
ProQuest (Firm)
author2_variant c b cb
j l jl
author2_role TeilnehmendeR
TeilnehmendeR
TeilnehmendeR
author_corporate ProQuest (Firm)
author_sort Bailey, Christopher.
title Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
spellingShingle Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Soldering & surface mount technology ;
title_full Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
title_fullStr Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
title_full_unstemmed Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
title_auth Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
title_new Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
title_sort advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
series Soldering & surface mount technology ;
series2 Soldering & surface mount technology ;
publisher Emerald Group Publishing,
publishDate 2006
physical 72 p.
callnumber-first T - Technology
callnumber-subject TK - Electrical and Nuclear Engineering
callnumber-label TK7870
callnumber-sort TK 47870.15 A48 42006
genre Electronic books.
genre_facet Electronic books.
url https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=267393
illustrated Not Illustrated
oclc_num 133162498
work_keys_str_mv AT baileychristopher advancedmanufacturingprocessleadfreeinterconnectmaterialsandreliabilitymodelingforelectronicspackaging
AT liujohan advancedmanufacturingprocessleadfreeinterconnectmaterialsandreliabilitymodelingforelectronicspackaging
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is_hierarchy_title Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
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