Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing / / Sheng Liu, Yong Liu.
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
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| Year of Publication: | 2011 |
| Language: | English |
| Online Access: | |
| Physical Description: | xxii, 564 p. :; ill. |
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| Summary: | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
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| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9780470827802 (hardback) 9780470827826 (oBook) 9781118082829 (Mobi) 9780470828410 (electronic bk.) 9780470827819 (electronic bk.) |
| Hierarchical level: | Monograph |
| Statement of Responsibility: | Sheng Liu, Yong Liu. |