Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing / / Sheng Liu, Yong Liu.
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
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| Year of Publication: | 2011 |
| Language: | English |
| Online Access: | |
| Physical Description: | xxii, 564 p. :; ill. |
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Table of Contents:
- pt. 1. Mechanics and modeling
- pt. 2. Modeling in microelectronic packaging and assembly
- pt. 3. Modeling in microelectronic package reliability and test
- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.