Advanced Interconnect and Packaging / / Wensheng Zhao, editor.
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...
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Place / Publishing House: | Basel : : MDPI - Multidisciplinary Digital Publishing Institute,, 2023. |
Year of Publication: | 2023 |
Language: | English |
Physical Description: | 1 online resource (266 pages) |
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245 | 0 | 0 | |a Advanced Interconnect and Packaging / |c Wensheng Zhao, editor. |
264 | 1 | |a Basel : |b MDPI - Multidisciplinary Digital Publishing Institute, |c 2023. | |
300 | |a 1 online resource (266 pages) | ||
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588 | |a Description based on publisher supplied metadata and other sources. | ||
520 | |a Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated circuits. To resolve these interconnect problems, various emerging technologies, including airgap, nanocarbon, optical, and through-silicon via (TSV), have been proposed and investigated. For example, by virtue of TSV technology, dies can be stacked to increase the integration density. More importantly, 3D integration and packaging also offer the most promising platform to implement "More-than-Moore" technologies, providing heterogeneous materials and technologies on a single chip. The "Advanced Interconnect and Packaging" Special Issue seeks to showcase research papers on new developments in advanced interconnect and packaging, i.e., on the design, modeling, fabrication, and reliability assessment of emerging interconnect and packaging technologies. Additionally, there are two interesting papers on carbon nanotube interconnects and interconnect reliability issues. | ||
504 | |a Includes bibliographical references. | ||
650 | 0 | |a Physics. | |
776 | |z 3-0365-6733-X | ||
700 | 1 | |a Zhao, Wensheng, |e editor. | |
906 | |a BOOK | ||
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AVE | |i DOAB Directory of Open Access Books |P DOAB Directory of Open Access Books |x https://eu02.alma.exlibrisgroup.com/view/uresolver/43ACC_OEAW/openurl?u.ignore_date_coverage=true&portfolio_pid=5345668250004498&Force_direct=true |Z 5345668250004498 |b Available |8 5345668250004498 |