Advanced Interconnect and Packaging / / Wensheng Zhao, editor.
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...
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| Place / Publishing House: | Basel : : MDPI - Multidisciplinary Digital Publishing Institute,, 2023. |
| Year of Publication: | 2023 |
| Language: | English |
| Physical Description: | 1 online resource (266 pages) |
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