Micro/Nano Structures and Systems : : Analysis, Design, Manufacturing, and Reliability / / Stelios K Georgantzinos, editor.

• TeilnehmendeR: Georgantzinos, Stelios K,
• Place / Publishing House: [Place of publication not identified] : : MDPI - Multidisciplinary Digital Publishing Institute,, 2023.
• Year of Publication: 2023
• Language: English
• Physical Description: 1 online resource (322 pages)

Micro/Nano Structures and Systems: Analysis, Design, Manufacturing, and Reliability is a comprehensive guide that explores the various aspects of micro- and nanostructures and systems. From analysis and design to manufacturing and reliability, this reprint provides a thorough understanding of the latest methods and techniques used in the field. With an emphasis on modern computational and analytical methods and their integration with experimental techniques, this reprint is an invaluable resource for researchers and engineers working in the field of micro- and nanosystems, including micromachines, additive manufacturing at the microscale, micro/nano-electromechanical systems, and more. Written by leading experts in the field, this reprint offers a complete understanding of the physical and mechanical behavior of micro- and nanostructures, making it an essential reference for professionals in this field.

Table of Contents

About the Editor vi -- Editorial for the Special Issue on Micro/Nano Structures and Systems: Analysis, Design, Manufacturing, and Reliability 1 -- Review Paper: Residual Stresses in Deposited Thin-Film Material Layers for Micro- and Nano-Systems Manufacturing 7 -- Optimization of Quality, Reliability, and Warranty Policies for Micromachines under Wear Degradation 63 -- An Annular Fresnel Zone Plate without Central Spots Fabricated by Femtosecond Laser Direct Writing 79 -- Design of a Cylindrical Compliant Linear Guide with Decoupling Parallelogram Mechanisms 91 -- Performance Evaluation of Different Coating Materials in Delamination for Micro-Milling Applications on High-Speed Steel Substrate 105 -- Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications 125 -- Numerical Study on the Cavitation Characteristics of Micro Automotive Electronic Pumps under Thermodynamic Effect 139 -- Electrochemical Milling of Deep-Narrow Grooves on GH4169 Alloy Using Tube Electrode with Wedged End Face 157 -- Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM 173 -- Atomic Layer Assembly Based on Sacrificial Templates for 3D Nanofabrication 189 -- Design Aspects of Additive Manufacturing at Microscale: A Review 213 -- A Comparative Evaluation of Magnetorheological Micropump Designs 237 -- Sensor Based on a Metal-Insulator-Metal Bus Waveguide Coupled with a U-Shaped Ring Resonator 257 -- Latest Performance Improvement Strategies and Techniques Used in 5G Antenna Designing Technology, a Comprehensive Study 267 -- Design of Deployable Structures by Using Bistable Compliant Mechanisms 295.