High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...

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Superior document:Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
:
Burger, Sofie
Year of Publication:2013
Language:English
Series:Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
Physical Description:1 electronic resource (XII, 140 p. p.)
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spelling Burger, Sofie auth
High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
KIT Scientific Publishing 2013
1 electronic resource (XII, 140 p. p.)
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.
English
damage structure
Fatigue
thin film
cantilever bending
3-7315-0025-6
language English
format eBook
author Burger, Sofie
spellingShingle Burger, Sofie
High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
author_facet Burger, Sofie
author_variant s b sb
author_sort Burger, Sofie
title High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_full High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_fullStr High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_full_unstemmed High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_auth High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_new High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_sort high cycle fatigue of al and cu thin films by a novel high-throughput method
series Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
series2 Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
publisher KIT Scientific Publishing
publishDate 2013
physical 1 electronic resource (XII, 140 p. p.)
isbn 1000034759
3-7315-0025-6
illustrated Not Illustrated
work_keys_str_mv AT burgersofie highcyclefatigueofalandcuthinfilmsbyanovelhighthroughputmethod
status_str n
ids_txt_mv (CKB)4920000000094664
(oapen)https://directory.doabooks.org/handle/20.500.12854/49267
(EXLCZ)994920000000094664
carrierType_str_mv cr
hierarchy_parent_title Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
is_hierarchy_title High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
container_title Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
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