High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...
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| Superior document: | Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie |
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| Year of Publication: | 2013 |
| Language: | English |
| Series: | Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
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| Physical Description: | 1 electronic resource (XII, 140 p. p.) |
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Electronic
| DOAB Directory of Open Access Books | Available |