Semiconductor packaging : : materials interaction and reliability / / Andrea Chen, Randy Hsiao-Yu Lo.

• VerfasserIn: Chen, Andrea.,
• TeilnehmendeR: Lo, Randy.
• Place / Publishing House: Boca Raton, Fla. : : CRC Press,, 2012.
• Year of Publication: 2012
• Edition: 1st edition
• Language: English
• Physical Description: 1 online resource (208 p.)
• Notes: Description based upon print version of record.

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world-- Provided by publisher.

Table of Contents

Front Cover; Contents; Preface; Authors; Partial list of abbreviations, acronyms, and symbols; Chapter 1: History and background; Chapter 2: Package form factors and families; Chapter 3: Surface-mount technology; Chapter 4: Other packaging needs; Chapter 5: Reliability testing; Chapter 6: Polymers; Chapter 7: Metals; Chapter 8: Ceramics and glasses; Chapter 9: Trends and challenges; Chapter 10: Light-emitting diodes; Glossary; Appendix A: Analytical tools; Appendix B: Destructive tools and tests; Back Cover