Miniaturized Transistors, Volume II

In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that mini...

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Year of Publication:2022
Language:English
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ctrlnum (CKB)5690000000012030
(oapen)https://directory.doabooks.org/handle/20.500.12854/87475
(EXLCZ)995690000000012030
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spelling Filipovic, Lado edt
Miniaturized Transistors, Volume II
Basel MDPI - Multidisciplinary Digital Publishing Institute 2022
1 electronic resource (352 p.)
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that miniaturization does not always refer to the latest technology node for digital transistors. Rather, by applying novel materials and device geometries, a significant reduction in the size of microelectronic devices for a broad set of applications can be achieved. The achievements made in the scaling of devices for applications beyond digital logic (e.g., high power, optoelectronics, and sensors) are taking the forefront in microelectronic miniaturization. Furthermore, all these achievements are assisted by improvements in the simulation and modeling of the involved materials and device structures. In particular, process and device technology computer-aided design (TCAD) has become indispensable in the design cycle of novel devices and technologies. It is our sincere hope that the results provided in this Special Issue prove useful to scientists and engineers who find themselves at the forefront of this rapidly evolving and broadening field. Now, more than ever, it is essential to look for solutions to find the next disrupting technologies which will allow for transistor miniaturization well beyond silicon’s physical limits and the current state-of-the-art. This requires a broad attack, including studies of novel and innovative designs as well as emerging materials which are becoming more application-specific than ever before.
English
Research & information: general bicssc
Mathematics & science bicssc
FinFETs
CMOS
device processing
integrated circuits
silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs)
solid state circuit breaker (SSCB)
prototype
circuit design
GaN
HEMT
high gate
multi-recessed buffer
power density
power-added efficiency
4H-SiC
MESFET
IMRD structure
power added efficiency
1200 V SiC MOSFET
body diode
surge reliability
silvaco simulation
floating gate transistor
control gate
CMOS device
active noise control
vacuum channel
mean free path
vertical air-channel diode
vertical transistor
field emission
particle trajectory model
F-N plot
space-charge-limited currents
4H-SiC MESFET
simulation
power added efficiency (PAE)
new device
three-input transistor
T-channel
compact circuit style
CMOS compatible technology
avalanche photodiode
SPICE model
bandwidth
high responsivity
silicon photodiode
AlGaN/GaN HEMTs
thermal simulation
transient channel temperature
pulse width
gate structures
band-to-band tunnelling (BTBT)
tunnelling field-effect transistor (TFET)
germanium-around-source gate-all-around TFET (GAS GAA TFET)
average subthreshold swing
direct source-to-drain tunneling
transport effective mass
confinement effective mass
multi-subband ensemble Monte Carlo
non-equilibrium Green's function
DGSOI
FinFET
core-insulator
gate-all-around
field effect transistor
GAA
nanowire
one-transistor dynamic random-access memory (1T-DRAM)
polysilicon
grain boundary
electron trapping
flexible transistors
polymers
metal oxides
nanocomposites
dielectrics
active layers
nanotransistor
quantum transport
Landauer-Büttiker formalism
R-matrix method
nanoscale
mosfet
quantum current
surface transfer doping
2D hole gas (2DHG)
diamond
MoO3
V2O5
MOSFET
reliability
random telegraph noise
oxide defects
SiO2
split-gate trench power MOSFET
multiple epitaxial layers
specific on-resistance
device reliability
nanoscale transistor
bias temperature instabilities (BTI)
defects
single-defect spectroscopy
non-radiative multiphonon (NMP) model
time-dependent defect spectroscopy
3-0365-4169-1
3-0365-4170-5
Grasser, Tibor edt
Filipovic, Lado oth
Grasser, Tibor oth
language English
format eBook
author2 Grasser, Tibor
Filipovic, Lado
Grasser, Tibor
author_facet Grasser, Tibor
Filipovic, Lado
Grasser, Tibor
author2_variant l f lf
t g tg
author2_role HerausgeberIn
Sonstige
Sonstige
title Miniaturized Transistors, Volume II
spellingShingle Miniaturized Transistors, Volume II
title_full Miniaturized Transistors, Volume II
title_fullStr Miniaturized Transistors, Volume II
title_full_unstemmed Miniaturized Transistors, Volume II
title_auth Miniaturized Transistors, Volume II
title_new Miniaturized Transistors, Volume II
title_sort miniaturized transistors, volume ii
publisher MDPI - Multidisciplinary Digital Publishing Institute
publishDate 2022
physical 1 electronic resource (352 p.)
isbn 3-0365-4169-1
3-0365-4170-5
illustrated Not Illustrated
work_keys_str_mv AT filipoviclado miniaturizedtransistorsvolumeii
AT grassertibor miniaturizedtransistorsvolumeii
status_str n
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carrierType_str_mv cr
is_hierarchy_title Miniaturized Transistors, Volume II
author2_original_writing_str_mv noLinkedField
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