Miniaturized Transistors, Volume II

In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that mini...

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Year of Publication:2022
Language:English
Physical Description:1 electronic resource (352 p.)
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520 |a In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that miniaturization does not always refer to the latest technology node for digital transistors. Rather, by applying novel materials and device geometries, a significant reduction in the size of microelectronic devices for a broad set of applications can be achieved. The achievements made in the scaling of devices for applications beyond digital logic (e.g., high power, optoelectronics, and sensors) are taking the forefront in microelectronic miniaturization. Furthermore, all these achievements are assisted by improvements in the simulation and modeling of the involved materials and device structures. In particular, process and device technology computer-aided design (TCAD) has become indispensable in the design cycle of novel devices and technologies. It is our sincere hope that the results provided in this Special Issue prove useful to scientists and engineers who find themselves at the forefront of this rapidly evolving and broadening field. Now, more than ever, it is essential to look for solutions to find the next disrupting technologies which will allow for transistor miniaturization well beyond silicon’s physical limits and the current state-of-the-art. This requires a broad attack, including studies of novel and innovative designs as well as emerging materials which are becoming more application-specific than ever before. 
546 |a English 
650 7 |a Research & information: general  |2 bicssc 
650 7 |a Mathematics & science  |2 bicssc 
653 |a FinFETs 
653 |a CMOS 
653 |a device processing 
653 |a integrated circuits 
653 |a silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs) 
653 |a solid state circuit breaker (SSCB) 
653 |a prototype 
653 |a circuit design 
653 |a GaN 
653 |a HEMT 
653 |a high gate 
653 |a multi-recessed buffer 
653 |a power density 
653 |a power-added efficiency 
653 |a 4H-SiC 
653 |a MESFET 
653 |a IMRD structure 
653 |a power added efficiency 
653 |a 1200 V SiC MOSFET 
653 |a body diode 
653 |a surge reliability 
653 |a silvaco simulation 
653 |a floating gate transistor 
653 |a control gate 
653 |a CMOS device 
653 |a active noise control 
653 |a vacuum channel 
653 |a mean free path 
653 |a vertical air-channel diode 
653 |a vertical transistor 
653 |a field emission 
653 |a particle trajectory model 
653 |a F-N plot 
653 |a space-charge-limited currents 
653 |a 4H-SiC MESFET 
653 |a simulation 
653 |a power added efficiency (PAE) 
653 |a new device 
653 |a three-input transistor 
653 |a T-channel 
653 |a compact circuit style 
653 |a CMOS compatible technology 
653 |a avalanche photodiode 
653 |a SPICE model 
653 |a bandwidth 
653 |a high responsivity 
653 |a silicon photodiode 
653 |a AlGaN/GaN HEMTs 
653 |a thermal simulation 
653 |a transient channel temperature 
653 |a pulse width 
653 |a gate structures 
653 |a band-to-band tunnelling (BTBT) 
653 |a tunnelling field-effect transistor (TFET) 
653 |a germanium-around-source gate-all-around TFET (GAS GAA TFET) 
653 |a average subthreshold swing 
653 |a direct source-to-drain tunneling 
653 |a transport effective mass 
653 |a confinement effective mass 
653 |a multi-subband ensemble Monte Carlo 
653 |a non-equilibrium Green's function 
653 |a DGSOI 
653 |a FinFET 
653 |a core-insulator 
653 |a gate-all-around 
653 |a field effect transistor 
653 |a GAA 
653 |a nanowire 
653 |a one-transistor dynamic random-access memory (1T-DRAM) 
653 |a polysilicon 
653 |a grain boundary 
653 |a electron trapping 
653 |a flexible transistors 
653 |a polymers 
653 |a metal oxides 
653 |a nanocomposites 
653 |a dielectrics 
653 |a active layers 
653 |a nanotransistor 
653 |a quantum transport 
653 |a Landauer-Büttiker formalism 
653 |a R-matrix method 
653 |a nanoscale 
653 |a mosfet 
653 |a quantum current 
653 |a surface transfer doping 
653 |a 2D hole gas (2DHG) 
653 |a diamond 
653 |a MoO3 
653 |a V2O5 
653 |a MOSFET 
653 |a reliability 
653 |a random telegraph noise 
653 |a oxide defects 
653 |a SiO2 
653 |a split-gate trench power MOSFET 
653 |a multiple epitaxial layers 
653 |a specific on-resistance 
653 |a device reliability 
653 |a nanoscale transistor 
653 |a bias temperature instabilities (BTI) 
653 |a defects 
653 |a single-defect spectroscopy 
653 |a non-radiative multiphonon (NMP) model 
653 |a time-dependent defect spectroscopy 
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