Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance...

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Superior document:Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
:
Year of Publication:2019
Language:English
Series:Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
Physical Description:1 electronic resource (X, 127 p. p.)
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520 |a Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations. 
546 |a English 
653 |a elektromechanische Charakterisierung 
653 |a flexible Elektronik 
653 |a thin-film devices 
653 |a Ink-jet printing 
653 |a flexible electronics 
653 |a synchrotron X-ray diffraction 
653 |a Dünnschichtbauteil 
653 |a Ink-jet drucken 
653 |a Synchrotron-Röntgenbeugung 
653 |a electro-mechanical characterization 
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