Semiconductor packaging : materials interaction and reliability / / Andrea Chen, Randy Hsiao-Yu Lo.
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| Year of Publication: | 2011 |
| Language: | English |
| Online Access: | |
| Physical Description: | xviii, 187 p. :; ill. |
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| 003 | MiAaPQ | ||
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| 006 | m o d | | ||
| 007 | cr cn||||||||| | ||
| 008 | 101002s2011 flua sb 000 0 eng d | ||
| 020 | |z 1439862052 | ||
| 020 | |z 9781439862056 | ||
| 035 | |a (MiAaPQ)500773636 | ||
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| 040 | |a MiAaPQ |c MiAaPQ |d MiAaPQ | ||
| 050 | 4 | |a TK7871.85 |b S4675 2011 | |
| 245 | 0 | 0 | |a Semiconductor packaging |h [electronic resource] : |b materials interaction and reliability / |c Andrea Chen, Randy Hsiao-Yu Lo. |
| 260 | |a Boca Raton : |b CRC Press, |c 2011. | ||
| 300 | |a xviii, 187 p. : |b ill. | ||
| 504 | |a Includes bibliographical references. | ||
| 533 | |a Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. | ||
| 650 | 0 | |a Semiconductors |x Reliability. | |
| 650 | 0 | |a Electronic packaging |x Reliability. | |
| 650 | 0 | |a Materials science. | |
| 650 | 0 | |a Electrical engineering. | |
| 655 | 4 | |a Electronic books. | |
| 700 | 1 | |a Chen, Andrea. | |
| 700 | 1 | |a Lo, Randy. | |
| 710 | 2 | |a ProQuest (Firm) | |
| 856 | 4 | 0 | |u https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=773636 |z Click to View |