Lead-free soldering process development and reliability /

Lead-free soldering process development and reliability / / edited by Jasbir Bath.

Saved in:
Bibliographic Details
Superior document:Wiley Series in Quality & Reliability Engineering
TeilnehmendeR:
Bath, Jasbir,
Place / Publishing House:Hoboken, New Jersey : : Wiley,, 2020.
Year of Publication:2020
Language:English
Series:Wiley series in quality & reliability engineering.
Online Access:
Physical Description:1 online resource (515 pages).
Tags: Add Tag
No Tags, Be the first to tag this record!
id 5006229588
ctrlnum (MiAaPQ)5006229588
(Au-PeEL)EBL6229588
(OCoLC)1159169475
collection bib_alma
record_format marc
spelling Lead-free soldering process development and reliability / edited by Jasbir Bath.
Hoboken, New Jersey : Wiley, 2020.
1 online resource (515 pages).
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Wiley Series in Quality & Reliability Engineering
Includes bibliographical references and index.
Description based on print version record.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2018. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Electronic packaging.
Solder and soldering.
Electronic books.
Bath, Jasbir, editor.
Print version: Lead-free soldering process development and reliability. Hoboken, New Jersey : Wiley, 2020 515 pages Wiley series in quality & reliability engineering. 9781119482031 (DLC) 2020004970
ProQuest (Firm)
Wiley series in quality & reliability engineering.
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=6229588 Click to View
language English
format eBook
author2 Bath, Jasbir,
author_facet Bath, Jasbir,
author2_variant j b jb
author2_role TeilnehmendeR
title Lead-free soldering process development and reliability /
spellingShingle Lead-free soldering process development and reliability /
Wiley Series in Quality & Reliability Engineering
title_full Lead-free soldering process development and reliability / edited by Jasbir Bath.
title_fullStr Lead-free soldering process development and reliability / edited by Jasbir Bath.
title_full_unstemmed Lead-free soldering process development and reliability / edited by Jasbir Bath.
title_auth Lead-free soldering process development and reliability /
title_new Lead-free soldering process development and reliability /
title_sort lead-free soldering process development and reliability /
series Wiley Series in Quality & Reliability Engineering
series2 Wiley Series in Quality & Reliability Engineering
publisher Wiley,
publishDate 2020
physical 1 online resource (515 pages).
isbn 9781119482048 (e-book)
9781119482031
callnumber-first T - Technology
callnumber-subject TK - Electrical and Nuclear Engineering
callnumber-label TK7870
callnumber-sort TK 47870.15 L433 42020
genre Electronic books.
genre_facet Electronic books.
url https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=6229588
illustrated Not Illustrated
dewey-hundreds 600 - Technology
dewey-tens 620 - Engineering
dewey-ones 621 - Applied physics
dewey-full 621.381/046
dewey-sort 3621.381 246
dewey-raw 621.381/046
dewey-search 621.381/046
oclc_num 1159169475
work_keys_str_mv AT bathjasbir leadfreesolderingprocessdevelopmentandreliability
status_str n
ids_txt_mv (MiAaPQ)5006229588
(Au-PeEL)EBL6229588
(OCoLC)1159169475
carrierType_str_mv cr
hierarchy_parent_title Wiley Series in Quality & Reliability Engineering
is_hierarchy_title Lead-free soldering process development and reliability /
container_title Wiley Series in Quality & Reliability Engineering
author2_original_writing_str_mv noLinkedField
_version_ 1792331021120700416
fullrecord <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01749nam a2200409 i 4500</leader><controlfield tag="001">5006229588</controlfield><controlfield tag="003">MiAaPQ</controlfield><controlfield tag="005">20201009100629.0</controlfield><controlfield tag="006">m o d | </controlfield><controlfield tag="007">cr cnu||||||||</controlfield><controlfield tag="008">201009s2020 nju ob 001 0 eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9781119482031</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119482048 (e-book)</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(MiAaPQ)5006229588</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(Au-PeEL)EBL6229588</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1159169475</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">MiAaPQ</subfield><subfield code="b">eng</subfield><subfield code="e">rda</subfield><subfield code="e">pn</subfield><subfield code="c">MiAaPQ</subfield><subfield code="d">MiAaPQ</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TK7870.15</subfield><subfield code="b">.L433 2020</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/046</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="0" ind2="0"><subfield code="a">Lead-free soldering process development and reliability /</subfield><subfield code="c">edited by Jasbir Bath.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Hoboken, New Jersey :</subfield><subfield code="b">Wiley,</subfield><subfield code="c">2020.</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (515 pages).</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Wiley Series in Quality &amp; Reliability Engineering</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index.</subfield></datafield><datafield tag="588" ind1=" " ind2=" "><subfield code="a">Description based on print version record.</subfield></datafield><datafield tag="590" ind1=" " ind2=" "><subfield code="a">Electronic reproduction. Ann Arbor, MI : ProQuest, 2018. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Electronic packaging.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Solder and soldering.</subfield></datafield><datafield tag="655" ind1=" " ind2="4"><subfield code="a">Electronic books.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Bath, Jasbir,</subfield><subfield code="e">editor.</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="t">Lead-free soldering process development and reliability.</subfield><subfield code="d">Hoboken, New Jersey : Wiley, 2020 </subfield><subfield code="h">515 pages </subfield><subfield code="k">Wiley series in quality &amp; reliability engineering.</subfield><subfield code="z">9781119482031 </subfield><subfield code="w">(DLC) 2020004970</subfield></datafield><datafield tag="797" ind1="2" ind2=" "><subfield code="a">ProQuest (Firm)</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Wiley series in quality &amp; reliability engineering.</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=6229588</subfield><subfield code="z">Click to View</subfield></datafield></record></collection>

Similar Items