Robust design of microelectronics assemblies against mechanical schock, temperature and moisture /

Robust design of microelectronics assemblies against mechanical schock, temperature and moisture / / E-H Wong, Y.-W Mai.

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Superior document:Woodhead Publishing series in electronic and optical materials, number 81
VerfasserIn:
Wong, E- H.,
Mai, Y.-W.,
TeilnehmendeR:
Mai, Y.-W.,
Place / Publishing House:Boston, MA : : Elsevier,, [2015]
2015
Year of Publication:2015
Language:English
Series:Woodhead Publishing series in electronic and optical materials ; no 81.
Online Access:
Physical Description:1 online resource (477 pages) :; illustrations (some color).
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ctrlnum (MiAaPQ)5002056911
(Au-PeEL)EBL2056911
(CaPaEBR)ebr11058676
(CaONFJC)MIL788494
(OCoLC)910159095
collection bib_alma
record_format marc
spelling Wong, E- H., author.
Robust design of microelectronics assemblies against mechanical schock, temperature and moisture / E-H Wong, Y.-W Mai.
Boston, MA : Elsevier, [2015]
2015
1 online resource (477 pages) : illustrations (some color).
text rdacontent
computer rdamedia
online resource rdacarrier
Woodhead Publishing series in electronic and optical materials, 2050-1501 ; number 81
Includes bibliographical references and index.
Description based on print version record.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2016. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Microelectronics Design.
Industrial design.
Robust control.
Electronic books.
Mai, Y.-W., author.
Print version: Wong, E- H. Robust design of microelectronics assemblies against mechanical schock, temperature and moisture. Boston, MA : Elsevier, [2015] Woodhead Publishing series in electronic and optical materials ; number 81 9781845695286 (DLC)18461254
ProQuest (Firm)
Woodhead Publishing series in electronic and optical materials ; no 81.
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=2056911 Click to View
language English
format eBook
author Wong, E- H.,
Mai, Y.-W.,
spellingShingle Wong, E- H.,
Mai, Y.-W.,
Robust design of microelectronics assemblies against mechanical schock, temperature and moisture /
Woodhead Publishing series in electronic and optical materials,
author_facet Wong, E- H.,
Mai, Y.-W.,
Mai, Y.-W.,
author_variant e h w eh ehw
y w m ywm
author_role VerfasserIn
VerfasserIn
author2 Mai, Y.-W.,
author2_role TeilnehmendeR
author_sort Wong, E- H.,
title Robust design of microelectronics assemblies against mechanical schock, temperature and moisture /
title_full Robust design of microelectronics assemblies against mechanical schock, temperature and moisture / E-H Wong, Y.-W Mai.
title_fullStr Robust design of microelectronics assemblies against mechanical schock, temperature and moisture / E-H Wong, Y.-W Mai.
title_full_unstemmed Robust design of microelectronics assemblies against mechanical schock, temperature and moisture / E-H Wong, Y.-W Mai.
title_auth Robust design of microelectronics assemblies against mechanical schock, temperature and moisture /
title_new Robust design of microelectronics assemblies against mechanical schock, temperature and moisture /
title_sort robust design of microelectronics assemblies against mechanical schock, temperature and moisture /
series Woodhead Publishing series in electronic and optical materials,
series2 Woodhead Publishing series in electronic and optical materials,
publisher Elsevier,
publishDate 2015
physical 1 online resource (477 pages) : illustrations (some color).
isbn 9780857099112
9781845695286
issn 2050-1501 ;
callnumber-first T - Technology
callnumber-subject TK - Electrical and Nuclear Engineering
callnumber-label TK7874
callnumber-sort TK 47874 W66 42015
genre Electronic books.
genre_facet Electronic books.
url https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=2056911
illustrated Illustrated
dewey-hundreds 600 - Technology
dewey-tens 620 - Engineering
dewey-ones 621 - Applied physics
dewey-full 621.381046
dewey-sort 3621.381046
dewey-raw 621.381046
dewey-search 621.381046
oclc_num 910159095
work_keys_str_mv AT wongeh robustdesignofmicroelectronicsassembliesagainstmechanicalschocktemperatureandmoisture
AT maiyw robustdesignofmicroelectronicsassembliesagainstmechanicalschocktemperatureandmoisture
status_str n
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(OCoLC)910159095
hierarchy_parent_title Woodhead Publishing series in electronic and optical materials, number 81
hierarchy_sequence no 81.
is_hierarchy_title Robust design of microelectronics assemblies against mechanical schock, temperature and moisture /
container_title Woodhead Publishing series in electronic and optical materials, number 81
author2_original_writing_str_mv noLinkedField
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