Author Search Results

1

Robust design of microelectronics assemblies against mechanical schock, temperature and moisture / / E-H Wong, Y.-W Mai.

Participants: Wong, E- H., [ VerfasserIn ]; Mai, Y.-W., [ VerfasserIn ]; Mai, Y.-W., [ TeilnehmendeR ]
Published: [2015]
Superior document: Woodhead Publishing series in electronic and optical materials, number 81

Other Authors: “...Mai, Y.-W.,...”

Links: Get full text

2

Fracture mechanics of electromagnetic materials : nonlinear field theory and applications / / Xiaohong Chen, Yiu-Wing Mai.

Participants: Chen, Xiaohong. [ ]; ProQuest (Firm) [ ]; Mai, Y. W., 1946- [ TeilnehmendeR ]; ProQuest (Firm) [ TeilnehmendeR ]
Published: c2013.

Other Authors: “...Mai, Y. W., 1946-...”

Links: Get full text

3

Composites technologies for 2020 : : proceedings of the Fourth Asian-Australasian Conference on Composite Materials (ACCM-4) : University of Sydney, Australia, 6-9 July 2004 / / edited by L. Ye, Y.-W. Mai and Z. Su.

Participants: Asian-Australasian Conference on Composite Materials Sydney, N.S.W.) [ ]; Mai, Y. W., 1946- [ TeilnehmendeR ]; Su, Z. [ TeilnehmendeR ]; Ye, L. 1962- [ TeilnehmendeR ]
Published: 2004.

Other Authors: “...Mai, Y. W., 1946-...”

Links: Get full text

4

Zeitschrift für Angewandte Mathematik und Mechanik : : =Journal of Applied Mathematics and Mechanics. / Volume 69, Number 3 / / ed. by H. Heinrich.

Participants: Bosznay, Á., [ MitwirkendeR, MitwirkendeR ]; Chakrabarti, A., [ MitwirkendeR, MitwirkendeR ]; Chakrabarti, A., [ MitwirkendeR ]; Dierscii, H.-J., [ MitwirkendeR, MitwirkendeR ]; Dierscii, H.-J., [ MitwirkendeR ]; ...
Published: [2022]
Superior document: Title is part of eBook package: De Gruyter DGBA Mathematics - <1990

Other Authors: “...Mai, Y. W.,...”

Links: Get full text; Get full text; Cover