Recent Advances in Thin Film Electronic Devices / / Chengyuan Dong.

• VerfasserIn: Dong, Chengyuan,
• Place / Publishing House: Basel : : MDPI - Multidisciplinary Digital Publishing Institute,, 2022.
• Year of Publication: 2022
• Language: English
• Physical Description: 1 online resource (152 pages)

This reprint is a collection of the papers from the Special Issue "Recent Advances in Thin Film Electronic Devices" in Micromachines. In this reprrint, 1 editorial and 11 original papers about recent advances in the research and development of thin film electronic devices are included. Specifically, three research fields are covered: device fundamentals (5 papers), fabrication processes (5 papers), and testing methods (1 paper). The experimental data, simulation results, and theoretical analysis presented in this reprint should benefit those researchers in flat panel displays, flat panel sensors, energy devices, memories, and so on.

Table of Contents

About the Editor -- Preface to "Recent Advances in Thin Film Electronic Devices" -- Editorial for the Special Issue on Recent Advances in Thin Film Electronic Devices -- Impact of the Semiconductor Defect Density on Solution-Processed Flexible Schottky Barrier Diodes -- Analysis of Nitrogen-Doping Effect on Sub-Gap Density of States in a-IGZO TFTs by TCAD Simulation -- Power Reduction in Punch-Through Current-Based Electro-Thermal Annealing in Gate-All-Around FETs -- An Artificial Synapse Based on CsPbI3 Thin Film -- A Reconfigurable Surface-Plasmon-Based Filter/Sensor Using D-Shaped Photonic Crystal Fiber -- Effect of the Deposition Time on the Structural, 3D Vertical Growth, and Electrical Conductivity Properties of Electrodeposited Anatase-Rutile Nanostructured Thin Films -- Application of Laser Treatment in MOS-TFT Active Layer Prepared by Solution Method -- Atmosphere Effect in Post-Annealing Treatments for Amorphous InGaZnO Thin-Film Transistors with SiOx Passivation Layers -- N-Type Nanosheet FETs without Ground Plane Region for Process Simplification -- Efficient Multi-Material Structured Thin Film Transfer to Elastomers for Stretchable Electronic Devices -- Non-Contact Optical Detection of Foreign Materials Adhered to Color Filter and Thin-Film Transistor.