Reliability Analysis of Electrotechnical Devices

This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.

Saved in:
Bibliographic Details
Sonstige:
Year of Publication:2022
Language:English
Physical Description:1 electronic resource (174 p.)
Tags: Add Tag
No Tags, Be the first to tag this record!
id 993553555904498
ctrlnum (CKB)5600000000483020
(oapen)https://directory.doabooks.org/handle/20.500.12854/91210
(EXLCZ)995600000000483020
collection bib_alma
record_format marc
spelling Tan, Cher Ming edt
Reliability Analysis of Electrotechnical Devices
Basel MDPI - Multidisciplinary Digital Publishing Institute 2022
1 electronic resource (174 p.)
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.
English
Technology: general issues bicssc
History of engineering & technology bicssc
3D-IC (three-dimensional integrated circuit)
electromagnetic interference
near field measurement
SAC305
BGA
low temperature
fracture failure
factorial design of experiment
genetic algorithm optimization
return loss
multiple-input multiple-output (MIMO)
single event effects
linear energy transfer
Monte Carlo simulation
radiation hardness
pressureless sintered micron silver joints
deep space environment
extreme thermal shocks
reconstruction
simulation
elastic mechanical properties
state of health
remaining useful life
electrochemistry based electrical model
semi-empirical capacity fading model
useful life distribution
quality and reliability assurance
single event effect
microdosimetry
lineal energy
deconvolution
gamma process
lifetime
measurement system analysis
reliability estimation
GaN
operational amplifier
proton therapy
prompt gamma imaging
3D X-ray
bias temperature-humidity reliability test
conductive anodic filament (CAF)
de-penalization
finite element analysis
3-0365-4653-7
3-0365-4654-5
Tan, Cher Ming oth
language English
format eBook
author2 Tan, Cher Ming
author_facet Tan, Cher Ming
author2_variant c m t cm cmt
author2_role Sonstige
title Reliability Analysis of Electrotechnical Devices
spellingShingle Reliability Analysis of Electrotechnical Devices
title_full Reliability Analysis of Electrotechnical Devices
title_fullStr Reliability Analysis of Electrotechnical Devices
title_full_unstemmed Reliability Analysis of Electrotechnical Devices
title_auth Reliability Analysis of Electrotechnical Devices
title_new Reliability Analysis of Electrotechnical Devices
title_sort reliability analysis of electrotechnical devices
publisher MDPI - Multidisciplinary Digital Publishing Institute
publishDate 2022
physical 1 electronic resource (174 p.)
isbn 3-0365-4653-7
3-0365-4654-5
illustrated Not Illustrated
work_keys_str_mv AT tancherming reliabilityanalysisofelectrotechnicaldevices
status_str n
ids_txt_mv (CKB)5600000000483020
(oapen)https://directory.doabooks.org/handle/20.500.12854/91210
(EXLCZ)995600000000483020
carrierType_str_mv cr
is_hierarchy_title Reliability Analysis of Electrotechnical Devices
author2_original_writing_str_mv noLinkedField
_version_ 1796652140790284291
fullrecord <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02913nam-a2200829z--4500</leader><controlfield tag="001">993553555904498</controlfield><controlfield tag="005">20231214132938.0</controlfield><controlfield tag="006">m o d </controlfield><controlfield tag="007">cr|mn|---annan</controlfield><controlfield tag="008">202208s2022 xx |||||o ||| 0|eng d</controlfield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CKB)5600000000483020</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(oapen)https://directory.doabooks.org/handle/20.500.12854/91210</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(EXLCZ)995600000000483020</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Tan, Cher Ming</subfield><subfield code="4">edt</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Reliability Analysis of Electrotechnical Devices</subfield></datafield><datafield tag="260" ind1=" " ind2=" "><subfield code="a">Basel</subfield><subfield code="b">MDPI - Multidisciplinary Digital Publishing Institute</subfield><subfield code="c">2022</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 electronic resource (174 p.)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.</subfield></datafield><datafield tag="546" ind1=" " ind2=" "><subfield code="a">English</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Technology: general issues</subfield><subfield code="2">bicssc</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">History of engineering &amp; technology</subfield><subfield code="2">bicssc</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">3D-IC (three-dimensional integrated circuit)</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">electromagnetic interference</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">near field measurement</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">SAC305</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">BGA</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">low temperature</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">fracture failure</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">factorial design of experiment</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">genetic algorithm optimization</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">return loss</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">multiple-input multiple-output (MIMO)</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">single event effects</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">linear energy transfer</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Monte Carlo simulation</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">radiation hardness</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">pressureless sintered micron silver joints</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">deep space environment</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">extreme thermal shocks</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">reconstruction</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">simulation</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">elastic mechanical properties</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">state of health</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">remaining useful life</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">electrochemistry based electrical model</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">semi-empirical capacity fading model</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">useful life distribution</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">quality and reliability assurance</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">single event effect</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">microdosimetry</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">lineal energy</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">deconvolution</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">gamma process</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">lifetime</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">measurement system analysis</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">reliability estimation</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">GaN</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">operational amplifier</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">proton therapy</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">prompt gamma imaging</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">3D X-ray</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">bias temperature-humidity reliability test</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">conductive anodic filament (CAF)</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">de-penalization</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">finite element analysis</subfield></datafield><datafield tag="776" ind1=" " ind2=" "><subfield code="z">3-0365-4653-7</subfield></datafield><datafield tag="776" ind1=" " ind2=" "><subfield code="z">3-0365-4654-5</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Tan, Cher Ming</subfield><subfield code="4">oth</subfield></datafield><datafield tag="906" ind1=" " ind2=" "><subfield code="a">BOOK</subfield></datafield><datafield tag="ADM" ind1=" " ind2=" "><subfield code="b">2023-12-15 05:36:56 Europe/Vienna</subfield><subfield code="f">system</subfield><subfield code="c">marc21</subfield><subfield code="a">2022-08-13 21:17:26 Europe/Vienna</subfield><subfield code="g">false</subfield></datafield><datafield tag="AVE" ind1=" " ind2=" "><subfield code="i">DOAB Directory of Open Access Books</subfield><subfield code="P">DOAB Directory of Open Access Books</subfield><subfield code="x">https://eu02.alma.exlibrisgroup.com/view/uresolver/43ACC_OEAW/openurl?u.ignore_date_coverage=true&amp;portfolio_pid=5339476580004498&amp;Force_direct=true</subfield><subfield code="Z">5339476580004498</subfield><subfield code="b">Available</subfield><subfield code="8">5339476580004498</subfield></datafield></record></collection>