Flexible Electronics: Fabrication and Ubiquitous Integration
Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweigh...
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Year of Publication: | 2019 |
Language: | English |
Physical Description: | 1 electronic resource (160 p.) |
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Martinez, Ramses V. auth Flexible Electronics: Fabrication and Ubiquitous Integration Flexible Electronics MDPI - Multidisciplinary Digital Publishing Institute 2019 1 electronic resource (160 p.) text txt rdacontent computer c rdamedia online resource cr rdacarrier Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage. English hydrophobic paper conformal design stretchability stretchable circuits long-term plasticity tunnel encapsulation bio-integrated devices epidermal sensors artificial synapses droplet circuits stretchable electronics island-bridge bottom-up approaches liquid metal feedback control durability dry/wet conditions solution electronics nano-fabrication surface plasmon-polariton (SPP) electronic measurements Polyvinyl Alcohol wireless power quantum tunneling effect low-cost manufacture non-developable surface top-down approaches reliability microwave photonics tissue adhesives temperature sensor brain-like intelligence electron transport wearable stimulators variable optical attenuator (VOA) ionic conduction design metrics flexible electronics flexible organic electronics soft biological tissue neuromorphic computing wearable heater quantum computing epidermal electronics tunable adhesion paper electronics 3-03897-828-0 |
language |
English |
format |
eBook |
author |
Martinez, Ramses V. |
spellingShingle |
Martinez, Ramses V. Flexible Electronics: Fabrication and Ubiquitous Integration |
author_facet |
Martinez, Ramses V. |
author_variant |
r v m rv rvm |
author_sort |
Martinez, Ramses V. |
title |
Flexible Electronics: Fabrication and Ubiquitous Integration |
title_full |
Flexible Electronics: Fabrication and Ubiquitous Integration |
title_fullStr |
Flexible Electronics: Fabrication and Ubiquitous Integration |
title_full_unstemmed |
Flexible Electronics: Fabrication and Ubiquitous Integration |
title_auth |
Flexible Electronics: Fabrication and Ubiquitous Integration |
title_alt |
Flexible Electronics |
title_new |
Flexible Electronics: Fabrication and Ubiquitous Integration |
title_sort |
flexible electronics: fabrication and ubiquitous integration |
publisher |
MDPI - Multidisciplinary Digital Publishing Institute |
publishDate |
2019 |
physical |
1 electronic resource (160 p.) |
isbn |
3-03897-829-9 3-03897-828-0 |
illustrated |
Not Illustrated |
work_keys_str_mv |
AT martinezramsesv flexibleelectronicsfabricationandubiquitousintegration AT martinezramsesv flexibleelectronics |
status_str |
n |
ids_txt_mv |
(CKB)4920000000095054 (oapen)https://directory.doabooks.org/handle/20.500.12854/47744 (EXLCZ)994920000000095054 |
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cr |
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Flexible Electronics: Fabrication and Ubiquitous Integration |
_version_ |
1787548505056739328 |
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<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03508nam-a2200829z--4500</leader><controlfield tag="001">993544310004498</controlfield><controlfield tag="005">20231214133523.0</controlfield><controlfield tag="006">m o d </controlfield><controlfield tag="007">cr|mn|---annan</controlfield><controlfield tag="008">202102s2019 xx |||||o ||| 0|eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3-03897-829-9</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CKB)4920000000095054</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(oapen)https://directory.doabooks.org/handle/20.500.12854/47744</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(EXLCZ)994920000000095054</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Martinez, Ramses V.</subfield><subfield code="4">auth</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Flexible Electronics: Fabrication and Ubiquitous Integration</subfield></datafield><datafield tag="246" ind1=" " ind2=" "><subfield code="a">Flexible Electronics</subfield></datafield><datafield tag="260" ind1=" " ind2=" "><subfield code="b">MDPI - Multidisciplinary Digital Publishing Institute</subfield><subfield code="c">2019</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 electronic resource (160 p.)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage.</subfield></datafield><datafield tag="546" ind1=" " ind2=" "><subfield code="a">English</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">hydrophobic paper</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">conformal design</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">stretchability</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">stretchable circuits</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">long-term plasticity</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">tunnel encapsulation</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">bio-integrated devices</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">epidermal sensors</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">artificial synapses</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">droplet circuits</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">stretchable electronics</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">island-bridge</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">bottom-up approaches</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">liquid metal</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">feedback control</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">durability</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">dry/wet conditions</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">solution electronics</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">nano-fabrication</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">surface plasmon-polariton (SPP)</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">electronic measurements</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Polyvinyl Alcohol</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">wireless power</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">quantum tunneling effect</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">low-cost manufacture</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">non-developable surface</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">top-down approaches</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">reliability</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">microwave photonics</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">tissue adhesives</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">temperature sensor</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">brain-like intelligence</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">electron transport</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">wearable stimulators</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">variable optical attenuator (VOA)</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">ionic conduction</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">design metrics</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">flexible electronics</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">flexible organic electronics</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">soft biological tissue</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">neuromorphic computing</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">wearable heater</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">quantum computing</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">epidermal electronics</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">tunable adhesion</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">paper electronics</subfield></datafield><datafield tag="776" ind1=" " ind2=" "><subfield code="z">3-03897-828-0</subfield></datafield><datafield tag="906" ind1=" " ind2=" "><subfield code="a">BOOK</subfield></datafield><datafield tag="ADM" ind1=" " ind2=" "><subfield code="b">2023-12-15 05:56:34 Europe/Vienna</subfield><subfield code="f">system</subfield><subfield code="c">marc21</subfield><subfield code="a">2019-11-10 04:18:40 Europe/Vienna</subfield><subfield code="g">false</subfield></datafield><datafield tag="AVE" ind1=" " ind2=" "><subfield code="i">DOAB Directory of Open Access Books</subfield><subfield code="P">DOAB Directory of Open Access Books</subfield><subfield code="x">https://eu02.alma.exlibrisgroup.com/view/uresolver/43ACC_OEAW/openurl?u.ignore_date_coverage=true&portfolio_pid=5337575590004498&Force_direct=true</subfield><subfield code="Z">5337575590004498</subfield><subfield code="b">Available</subfield><subfield code="8">5337575590004498</subfield></datafield></record></collection> |