Temperature and oxygen partial pressure dependences of the surface tension of liquid Sn-Ag and Sn-Cu lead-free solder alloys / Joonho Lee, Wataru Shimoda, and Toshihiro Tanaka
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| Superior document: | Enthalten in Thermodynamics of alloys ; ed. by Peter Terzieff ... Wien [u.a.], 2005 S. [1829] - 1834 Monatshefte für Chemie ; 136.2005,11 |
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| VerfasserIn: | |
| Place / Publishing House: | 2005 |
| Year of Publication: | 2005 |
| Language: | English |
| Physical Description: | graph. Darst. |
| Notes: | Literaturverz. S. 1834 |
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| ac_no: | AC05248605 |
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| Hierarchical level: | Article, Chapter, ... |
| Statement of Responsibility: | Joonho Lee, Wataru Shimoda, and Toshihiro Tanaka |