Bogatin's Practical Guide to Prototype Breadboard and PCB Design.

Bogatin's Practical Guide to Prototype Breadboard and PCB Design.

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Bibliographic Details
:
Bogatin, Eric.
Place / Publishing House:Norwood : : Artech House,, 2021.
Ã2021.
Year of Publication:2021
Edition:1st ed.
Language:English
Online Access:
Physical Description:1 online resource (521 pages)
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Table of Contents:
  • BOGATIN'S PRACTICAL GUIDE to PROTOTYPE BREADBOARD and PCB DESIGN
  • Table of Contents
  • Chapter 1 A Getting-Started Guide
  • 1.1 Who This Book Is For
  • 1.2 Getting Stuff Done
  • 1.3 Cost-Performace Trade-offs
  • 1.4 Errors, Best Practices, and Habits
  • 1.5 Learn to Design-in Success
  • 1.6 A Getting-Started Guide for Signal Integrity
  • 1.7 The Seven-Step Process
  • 1.8 Risk Management and Mitigation
  • 1.9 Two Risk Management Design Strategies
  • 1.0 Master of Murphy's Law
  • 1.11 Proof of Concept
  • 1.12 Practice Questions
  • Chapter 2 PCB Technology
  • 2.1 PCB, PWB, or PCA?
  • 2.2 Physical Design of a PCB
  • 2.3 Vias Technologies
  • 2.4 Thermal and Thermal Relief Vias
  • 2.5 Other Layers
  • 2.6 The Soldermask Layer
  • 2.7 Surface Finishes
  • 2.8 The Silk Screen
  • 2.9 What the Fab Vendor Needs
  • 2.10 Practice Questions
  • Chapter 3 Signal Integrity and Interconnects
  • 3.1 Transparent Interconnects
  • 3.2 When Interconnets are NOT Transparent
  • 3.3 Where Signal Integrity Lives
  • 3.4 Six Categories of Electrical Noise
  • 3.5 Families of SI/PI/EMI Problems
  • 3.6 In Principle and In Practice
  • 3.7 Net Classes and Interconnect Problems
  • 3.9 Design for X
  • 3.10 Practice Questions
  • Chapter 4 Electrical Properties of Interconnects
  • 4.1 Ideal vs Real Circuit Elements
  • 4.2 Equivalent Electrical Circuit Models
  • 4.3 Parasitic Extraction of R, L, and C Elements
  • 4.4 Describing Cross Talk
  • 4.5 Estimating Mutual Inductance
  • 4.6 Training Your Engineer's Mind's Eye
  • 4.7 Electrically Long Interconnects
  • 4.8 Electrically Short and Electrically Long
  • 4.9 Practice Questions
  • Chapter 5 Trace Width Considerations: Max Current
  • 5.1 Best design practices
  • 5.2 Minimum Fabrication Trace Width
  • 5.3 Copper Thickness as Ounces of Copper
  • 5.4 Maximum Current Handling of a Trace
  • 5.5 Maximum Current Through a Via.
  • 5.6 Thermal Runaway with Constant Current
  • 5.7 Practice Questions
  • Chapter 6 Trace Width Considerations: Series Resistance
  • 6.1 Resistance of Any Uniform Conductor
  • 6.2 Sheet Resistance of a Copper Layer
  • 6.3 Measuring Very Low Resistances
  • 6.4 Voltage Drop Across Traces
  • 6.5 The Thevenin Model of a Voltage Source
  • 6.6 How Much Trace Resistance Is too Much?
  • 6.7 The Resistance of a Via
  • 6.8 Resistance of a Thermal Relief Via
  • 6.9 Practice Questions
  • Chapter 7 The Seven Steps in Creating a PCB
  • 7.1 Step 1: Plan of Record
  • 7.2 Step 2: Create the BOM
  • 7.3 Step 3: Complete the Schematic
  • 7.4 Step 4: Complete the Layout, Order the Parts
  • 7.5 Steps 5 and 6: Assembly and Bring-Up
  • 7.6 Step 7: Documentation
  • 7.7 Practice Questions
  • Chapter 8 Step 1, POR: Risk Mitigation
  • 8.1 Visualize the Entire Project Before You Begin
  • 8.2 Avoid Feature Creep
  • 8.3 Estimate Everything You Can
  • 8.4 Preliminary BOM: Critical Components
  • 8.5 Risk Assessment
  • 8.6 Risk Mitigation: Tented Vias
  • 8.7 Risk Mitigation: Qualified Parts
  • 8.8 Practice Questions
  • Chapter 9 Risk Reduction: Datasheets, Reverse Engineering, and Component Selection
  • 9.1 Take Responsibility for Your Design
  • 9.2 Reducing the Risk of a Design Problem
  • 9.3 Understand Your Circuit
  • 9.4 Read Datasheets Critically
  • 9.5 Build Simple Evaluation Prototypes
  • 9.6 Reverse Engineer Components
  • 9.7 Reuse Parts
  • 9.8 Practice Questions
  • Chapter 10 Risk Reduction: Virtual and Real Prototypes
  • 10.1 Getting Started with Circuit Simulation
  • 10.2 Practice Safe Simulation
  • 10.3 Simulating a 555 Circuit
  • 10.4 Purchase an Evaluation Board
  • 10.5 Real Prototypes with Modules
  • 10.6 Practice Questions
  • Chapter 11 Risk Reduction: Prototyping with a Solderless Breadboard
  • 11.1 Build a Real Prototype
  • 11.2 Solderless Breadboards for POC.
  • 11.3 Features of a Solderless Breadboard
  • 11.4 Bandwidth Limitations
  • 11.5 A Simple Breakout Board
  • 11.6 The Mini Solderless Breadboard
  • 11.7 Best Wiring Habits
  • 11.8 Habit #1: Consistent Column Assignments
  • 11.9 Habit #2: Color Code the Wires
  • 11.10 Habit #3: Keep Signal Traces Short
  • 11.11 Habit #4: Avoid a Shared Return Path
  • 11.12 Habit #5: Route Signal-Return Pairs
  • 11.13 Habit #6: Keep Component Leads Short
  • 11.14 Practice Questions
  • Chapter 12 Switching Noise and Return Path Routing
  • 12.1 The Origin of Switching Noise
  • 12.2 Signal-Return Path Loops
  • 12.3 Where Does Return Current Flow?
  • 12.4 A Plane as a Return Path
  • 12.5 Ground
  • 12.6 Avoid Gaps in the Return Plane
  • 12.7 Summary of the Best design practices
  • 12.8 Practice Questions
  • Chapter 13 Power Delivery
  • 13.1 Origin of Power Rail Switching Noise
  • 13.2 Calculating Loop Inductance
  • 13.3 Measuring PDN Switching Noise
  • 13.4 The Role of Decoupling Capacitors
  • 13.5 Where Do Decoupling Capacitors Go?
  • 13.6 The Power Delivery Path
  • 13.7 Inrush Current
  • 13.8 Summary of the Eight Habits for Using a SSB
  • 13.9 Practice Questions
  • Chapter 14 Design for Performance: The PDN on a PCB
  • 14.1 VRM specifications
  • 14.2 Voltage Regulator Module
  • 14.3 Self- and Mutual-Aggression Noise
  • 14.4 Power and Ground Loop Inductance
  • 14.5 Decoupling Capacitors
  • 14.6 A Decoupling Capacitor Myth
  • Part 1
  • 14.7 A Decoupling Capacitor Myth
  • Part 2
  • 14.8 Routing for Power Distribution
  • 14.9 Ferrite Beads
  • 14.10 Summary of the Best design practices
  • 14.11 Practice Questions
  • Chapter 15 Risk Reduction: Design for Bring-Up
  • 15.1 Test is Too General a Term
  • 15.2 What Does It Mean to "Work"?
  • 15.3 Design for Bring-Up
  • 15.4 Add Design for Bring-Up Features
  • 15.5 Jumper Switches
  • 15.6 LED indicators
  • 15.7 Test Points.
  • 15.8 The Power Rail as a Diagnostic
  • 15.9 Practice Questions
  • Chapter 16 Risk Reduction: Design Reviews
  • 16.1 The Preliminary Design Review
  • 16.2 The Critical Design Review
  • 16.3 DRC for DFM in the CDR
  • 16.4 DRC for Signal Integrity
  • 16.5 Layout Review
  • 16.6 Practice Questions
  • Chapter 17 Step 2: Surface-Mount or Through-Hole Parts
  • 17.1 Through-Hole and Surface-Mount
  • 17.2 Types of SMT Parts
  • 17.3 Integrated Circuit Components
  • 17.4 Practice Questions
  • Chapter 18 Finding the One Part in a Million
  • 18.1 An Important Selection Process
  • 18.2 Trade-offs in Selecting Parts
  • 18.3 The Search Order to Select a Part
  • 18.4 Selecting Resistors
  • 18.5 Selecting Capacitors
  • 18.6 The BOM
  • 18.7 Summary of the Best Design Practices
  • 18.8 Selecting Parts for Automated Assembly
  • 18.9 Practice Questions
  • Chapter 19 Step 3: Schematic Capture and Final BOM
  • 19.1 Picking a Project Name
  • 19.2 Schematic Capture
  • 19.3 Take Ownership of Reference Designs
  • 19.4 Add Options to Your Schematic
  • 19.5 Best design practices for Schematic Entry
  • 19.6 Design Review and ERC
  • 19.7 Practice Questions
  • Chapter 20 Step 4: Layout - Setting Up the Board
  • 20.1 Layout
  • 20.2 Board Dimensions
  • 20.3 The Layers in a Board Stack
  • 20.4 Negative and Positive Layers
  • 20.5 Examples of Some Fab Shop DFM Features
  • 20.6 Setting Up Design Constraints
  • 20.7 Thermal Reliefs in Pads and Vias
  • 20.8 Set Up Board Size and Keepout Layer
  • 20.9 Practice Questions
  • Chapter 21 Floor Planning and Routing Priority
  • 21.1 Part Placement
  • 21.2 The Order of Placement and Routing
  • 21.3 First Priority: Ground Plane on the Bottom Layer
  • 21.4 Second Priority: Decoupling Capacitors
  • 21.5 Third Priority: Ground Connections
  • 21.6 Fourth Priority: Digital Signals, Congested Signals
  • 21.7 Fifth Priority: Power Paths.
  • 21.8 The Silk Screen
  • 21.9 Check the Soldermask
  • 21.10 Soldermask Color
  • 21.11 Layout - Critical Design Review
  • 21.12 Practice Questions
  • Chapter 22 Six Common Misconceptions about Routing
  • 22.1 Myth #1: Avoid 90 Deg Corners
  • 22.2 Myth #2: Add Copper Pour on Signal Layers
  • 22.3 Myth #3: Use Different Value Decoupling Capacitors
  • 22.4 Myth #4: Split Ground Plan
  • 22.5 Myth #5: Use Power Planes
  • 22.6 Myth #6: Use 50 Ohm Impedance Traces
  • 22.7 Practice Questions
  • Chapter 23 Four-Layer Boards
  • 23.1 Two-Layer Stack-Ups
  • 23.2 A 4-Layer Board
  • 23.3 Four-Layer Stack-Up Options
  • 23.4 Stack-Up Options with Two Planes
  • 23.5 The Recommended 4-Layer Stack-Up
  • 23.6 When Signals Change Return Planes
  • 23.7 Practice Questions
  • Chapter 24 Release the Board to the Fab Shop
  • 24.1 Gerber Files
  • 24.2 Cost Adders
  • 24.3 Board Release Checklist
  • 24.4 Practice Questions
  • Chapter 25 Step 6: Bring-Up
  • 25.1 Does Your Widget Work?
  • 25.2 Prototype or Production Testing
  • 25.3 Design for Bring-Up
  • 25.4 Find the Root Cause
  • 25.5 Problems to Expect
  • 25.6 Troubleshoot Like a Detective
  • 25.7 Trick #1: Recreate the Problem
  • 25.8 Trick #2: Seen This Problem Before?
  • 25.9 Trick #3: Round Up the Usual Suspects
  • 25.10 Trick #4: Three Possible Explanations
  • 25.11 A Methodology
  • 25.12 Forensic Analysis
  • 25.13 Coding Issues
  • 25.14 Practice Questions
  • Chapter 26 Step 7: Documentation
  • Chapter 27 Concluding Comments
  • Chapter 28 About Eric Bogatin.

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