SiP-system in package design and simulation : : MentorGraphics Expedition Enterprise Flow advanced design guide / / Suny Li.

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Place / Publishing House:Hoboken, New Jersey ; : Publishing House of Electronics Industry :, Fusionopolis, Solaris South Tower, Singapore : : Wiley,, 2017.
2017
Year of Publication:2017
Language:English
Online Access:
Physical Description:1 online resource (486 pages) :; illustrations (some color)
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id 5004915580
ctrlnum (MiAaPQ)5004915580
(Au-PeEL)EBL4915580
(CaPaEBR)ebr11412608
(CaONFJC)MIL1021882
(OCoLC)994710127
collection bib_alma
record_format marc
spelling Li, Suny, 1974- author.
SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide / Suny Li.
Hoboken, New Jersey ; Fusionopolis, Solaris South Tower, Singapore : Publishing House of Electronics Industry : Wiley, 2017.
2017
1 online resource (486 pages) : illustrations (some color)
text rdacontent
computer rdamedia
online resource rdacarrier
Includes bibliographical references and indexes.
Description based on print version record.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2016. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Integrated circuits Design and construction.
Multichip modules (Microelectronics) Design and construction.
Electronic books.
Print version: Li, Suny, 1974- SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide. Hoboken, New Jersey ; Fusionopolis, Solaris South Tower, Singapore : Publishing House of Electronics Industry ; Wiley, c2017 xvii, 477 pages 9781119045939 2017007232
ProQuest (Firm)
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=4915580 Click to View
language English
format eBook
author Li, Suny, 1974-
spellingShingle Li, Suny, 1974-
SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide /
author_facet Li, Suny, 1974-
author_variant s l sl
author_role VerfasserIn
author_sort Li, Suny, 1974-
title SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide /
title_sub MentorGraphics Expedition Enterprise Flow advanced design guide /
title_full SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide / Suny Li.
title_fullStr SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide / Suny Li.
title_full_unstemmed SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide / Suny Li.
title_auth SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide /
title_new SiP-system in package design and simulation :
title_sort sip-system in package design and simulation : mentorgraphics expedition enterprise flow advanced design guide /
publisher Publishing House of Electronics Industry : Wiley,
publishDate 2017
physical 1 online resource (486 pages) : illustrations (some color)
isbn 9781119046011
9781119045939
callnumber-first T - Technology
callnumber-subject TK - Electrical and Nuclear Engineering
callnumber-label TK7874
callnumber-sort TK 47874 L5 42017
genre Electronic books.
genre_facet Electronic books.
url https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=4915580
illustrated Illustrated
dewey-hundreds 600 - Technology
dewey-tens 620 - Engineering
dewey-ones 621 - Applied physics
dewey-full 621.3815
dewey-sort 3621.3815
dewey-raw 621.3815
dewey-search 621.3815
oclc_num 994710127
work_keys_str_mv AT lisuny sipsysteminpackagedesignandsimulationmentorgraphicsexpeditionenterpriseflowadvanceddesignguide
status_str n
ids_txt_mv (MiAaPQ)5004915580
(Au-PeEL)EBL4915580
(CaPaEBR)ebr11412608
(CaONFJC)MIL1021882
(OCoLC)994710127
is_hierarchy_title SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide /
_version_ 1792330956048171008
fullrecord <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02040nam a2200421 i 4500</leader><controlfield tag="001">5004915580</controlfield><controlfield tag="003">MiAaPQ</controlfield><controlfield tag="005">20200520144314.0</controlfield><controlfield tag="006">m o d | </controlfield><controlfield tag="007">cr cnu||||||||</controlfield><controlfield tag="008">170811t20172017njua ob 001 0 eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9781119045939</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119046011</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(MiAaPQ)5004915580</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(Au-PeEL)EBL4915580</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CaPaEBR)ebr11412608</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CaONFJC)MIL1021882</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)994710127</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">MiAaPQ</subfield><subfield code="b">eng</subfield><subfield code="e">rda</subfield><subfield code="e">pn</subfield><subfield code="c">MiAaPQ</subfield><subfield code="d">MiAaPQ</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TK7874</subfield><subfield code="b">.L5 2017</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield><subfield code="2">23</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Li, Suny,</subfield><subfield code="d">1974-</subfield><subfield code="e">author.</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">SiP-system in package design and simulation :</subfield><subfield code="b">MentorGraphics Expedition Enterprise Flow advanced design guide /</subfield><subfield code="c">Suny Li.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Hoboken, New Jersey ;</subfield><subfield code="a">Fusionopolis, Solaris South Tower, Singapore :</subfield><subfield code="b">Publishing House of Electronics Industry :</subfield><subfield code="b">Wiley,</subfield><subfield code="c">2017.</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">2017</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (486 pages) :</subfield><subfield code="b">illustrations (some color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and indexes.</subfield></datafield><datafield tag="588" ind1=" " ind2=" "><subfield code="a">Description based on print version record.</subfield></datafield><datafield tag="590" ind1=" " ind2=" "><subfield code="a">Electronic reproduction. Ann Arbor, MI : ProQuest, 2016. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Integrated circuits</subfield><subfield code="x">Design and construction.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Multichip modules (Microelectronics)</subfield><subfield code="x">Design and construction.</subfield></datafield><datafield tag="655" ind1=" " ind2="4"><subfield code="a">Electronic books.</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="a">Li, Suny, 1974-</subfield><subfield code="t">SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide.</subfield><subfield code="d">Hoboken, New Jersey ; Fusionopolis, Solaris South Tower, Singapore : Publishing House of Electronics Industry ; Wiley, c2017 </subfield><subfield code="h">xvii, 477 pages </subfield><subfield code="z">9781119045939 </subfield><subfield code="w">2017007232</subfield></datafield><datafield tag="797" ind1="2" ind2=" "><subfield code="a">ProQuest (Firm)</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=4915580</subfield><subfield code="z">Click to View</subfield></datafield></record></collection>