Interfacial Phenomena in Adhesion and Adhesive Bonding.

• Author: Horiuchi, Shin.
• TeilnehmendeR: Terasaki, Nao.; Miyamae, Takayuki.
• Place / Publishing House: Singapore : : Springer Singapore Pte. Limited,, 2023.; ©2024.
• Year of Publication: 2023
• Edition: 1st ed.
• Language: English
• Physical Description: 1 online resource (368 pages)

Table of Contents

Intro -- Preface -- Contents -- Abbreviations -- Introduction-Interfaces in Adhesion and Adhesive Bonding -- 1 Social Background of Research on Adhesion and Adhesive Bonding -- 2 Interphase in Adhesive Bonding -- 3 Testing of Adhesion and Adhesive Bonding -- 4 Multiscale and Hierarchical Structures in the Interphase and Interfacial Region in Adhesive Bonding -- 5 Visualization and Analysis of Interphases in Adhesion and Adhesive Bonding -- References -- Electron Microscopy for Visualization of Interfaces in Adhesion and Adhesive Bonding -- 1 Instrumentation of Electron Microscopy -- 2 Analytical Electron Microscopy-EDX and EELS -- 3 Specimen Preparation -- 3.1 Preparation of Thin Sections by Ultramicrotomy -- 3.2 Staining -- 3.3 Focused Ion Beam Fabrication (FIB) -- 3.4 Surface Replica -- 4 EFTEM -- 4.1 Electron Spectroscopic Imaging (ESI) and Parallel EELS -- 4.2 Elemental Mapping and Image-EELS -- 5 STEM -- 5.1 Spectrum Imaging (SI) with Simultaneous EELS and EDX -- 5.2 ELNES Phase Mapping -- 5.3 Tomography and 3D Elemental Mapping -- 6 SEM -- 6.1 Energy-Filtered SE Imaging -- 6.2 Correlative Raman Imaging and SEM -- 7 In Situ TEM -- 8 Specimen Damages by Electron Beam Irradiation -- 8.1 Mass Loss in Polymer Thin Sections -- 8.2 Chemical Damages of Polymers Evaluated by ELNES -- 8.3 Electron-Induced Contamination -- 9 Conclusions -- References -- Interfacial Phenomena in Adhesion and Adhesive Bonding Investigated by Electron Microscopy -- 1 Visualization of Homopolymer/Random Copolymer Interfaces by EFTEM -- 2 Thermodynamic Acceleration of Interdiffusion in Miscible Polymer Pairs -- 3 Role of Interfacial Entanglements on Interfacial Toughness Studied by Nanofractography -- 3.1 Interfacial Thickness and Toughness in PMMA/SAN Interfaces -- 3.2 Interfacial Entanglements at PS/PS Welded Interfaces.

3.3 Mechanism of Low-Temperature Bonding of VUV-Activated COP -- 4 Adhesive Bonding by Surface and Interface Modifications of Polypropylene-Effect of Chemical Bonding and Mechanical Interlocking -- 5 Formation of the Interphase Between Aluminum and Polypropylene-The Role of Reactive Functionality on Metal Bonding -- 5.1 Bonding Mechanism Investigated by Replica-STEM Tomography -- 5.2 Mechanism of Interphase Formation -- 6 Mechanism of Adhesive Bonding of Aluminum Alloys Studied by STEM-EELS/ELNES -- 6.1 Mechanism of Steam Treatment in Improving Adhesion Bonding of Aluminum -- 6.2 Role of the Chemical Bonding on Interfacial Toughness Between Aluminum and Epoxy Adhesive -- 7 Metal-plastic Direct Bonding by Injection Nano-Molding-Interfacial Structures and Testing Joint Performance -- 8 Toughness and Durability of Interfaces in Dissimilar Adhesive Joints of Aluminum and Carbon-Fiber Reinforced Thermoplastics -- 8.1 Evaluation of Interfacial Fracture Toughness by ADCB Test -- 8.2 Evaluation of Durability of Adhesive Interfaces Under High Humidity Environment by Wedge Test -- 8.3 Stress-Induced Corrosion at Adhesive Interfaces -- 9 Concluding Remark -- References -- Direct Visualization of Mechanical Behavior During Adhesive Bonding Failure Using Mechanoluminescence (ML) -- 1 Introduction of Mechanoluminescence-Materials, Sensor and Sensing Concept -- 2 Mechanoluminescence (ML) Technology-Visualization of the Dynamic Strain Information -- 2.1 Mechanoluminescence (ML) Materials -- 2.2 Mechanoluminescence (ML) Sensors -- 3 Killer Application of Mechanoluminescence 1: Detection of Crack and Defects in Structural Health Monitoring (SHM) -- 3.1 Mechanoluminescence (ML) Detection of the Origin to Deduce the Integrity -- 3.2 Mechanoluminescence (ML) Sensing in Real Infrastructures -- 3.3 Visualization of Repair Effect Using Mechanoluminescence (ML).

4 Killer Application of Mechanoluminescence 2: Innovation in Design and Prediction -- 4.1 Mechanoluminescence (ML) Sensing in CFRP Composite Material -- 4.2 Simulation Sophistication Using Mechanoluminescence (ML) -- 5 Mechanoluminescent (ML) Visualization in the Evaluation of Adhesive Joint -- 5.1 Fracture Toughness for Crack Propagation -- 5.2 Tensile Shear Strength (TSS) Test of Adhesive Joint -- 5.3 Cross-Tension Strength (CTS) Test of Adhesive Joint -- 5.4 Mapping of Weak Bond and Local Fracture Toughness -- 6 New Challenge for the Invisible Information on the Lightweight Structure -- 6.1 Toward the Appropriate Choice of Joints in the Multi-material Concept -- 6.2 Static Electricity in Light Weighting Structure -- 7 Concluding Remark -- References -- Analysis of Molecular Surface/Interfacial Layer by Sum-Frequency Generation (SFG) Spectroscopy -- 1 Introduction -- 2 Basic Theory for Surface/Interface Sum-Frequency Generation -- 3 Experimental Equipment -- 3.1 General Description of the Experimental Equipment -- 3.2 SFG Spectroscopy with Narrowband Input -- 3.3 SFG Spectroscopy with a Broadband Input -- 3.4 Doubly-Resonant Sum-Frequency Generation Spectrometer -- 3.5 Experimental Conditions for Polymeric Material Surfaces and Adhesive Interfaces -- 4 Applications of SFG Spectroscopy to Study Polymeric Materials Surfaces and Interfaces -- 4.1 Chemical Structure of Adherent Surfaces -- 5 Investigation of Buried Polymer/polymer Interfaces -- 6 Probing Adhesive Interfaces -- 6.1 Polyurethane Adhesives -- 6.2 Silyl-Terminated Polyether Adhesives -- 7 Metal/polymer Interfaces -- 8 Bio-adhesive Interfaces -- 9 Molecular Conformation at the Liquid Interfaces -- 10 Molecular Conformation at the Organic Device Interfaces -- 11 Comprehensive Study of Adhesive Interfaces Combining SFG with Other Techniques.

11.1 Acid-Base Interaction at the Epoxy Adhesive/AlOx Interface -- 11.2 Formation of Covalent Bonds -- 11.3 Ordering of Functional Group at AlOx Interface -- 11.4 Interaction Between Surface O-H Bonds and Adsorbates -- 12 Summary and Outlook -- References.