11th international congress molded interconnect devices : : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jorg Franke [and three others].
Saved in:
| Superior document: | Advanced Materials Research, Volume 1038 |
|---|---|
| : | |
| TeilnehmendeR: | |
| Place / Publishing House: | Pfaffikon, Switzerland : : TTP,, 2014. Enfield, New Hampshire : : Trans Tech Publications Ltd,, [date of distribution not identified] 2014 |
| Year of Publication: | 2014 |
| Language: | English |
| Series: | Advanced materials research ;
Volume 1038. |
| Online Access: | |
| Physical Description: | 1 online resource (119 pages) :; illustrations. |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| id |
5001910949 |
|---|---|
| ctrlnum |
(MiAaPQ)5001910949 (Au-PeEL)EBL1910949 (CaPaEBR)ebr10951273 (OCoLC)893677821 |
| collection |
bib_alma |
| record_format |
marc |
| spelling |
International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany) 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jorg Franke [and three others]. Pfaffikon, Switzerland : TTP, 2014. Enfield, New Hampshire : Trans Tech Publications Ltd, [date of distribution not identified] 2014 1 online resource (119 pages) : illustrations. text rdacontent computer rdamedia online resource rdacarrier Advanced Materials Research, 1662-8985 ; Volume 1038 Includes bibliographical references at the end of each chapters and index. Description based on online resource; title from PDF title page (ebrary, viewed October 16, 2014). Electronic reproduction. Ann Arbor, MI : ProQuest, 2016. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. Molded interconnect devices. Three-dimensional display systems Congresses. Electronic books. Franke, Jorg, editor. Print version: International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany) 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. Pfaffikon, Switzerland : TTP, c2014 124 pages Advanced materials research ; Volume 1038. 9783038352525 ProQuest (Firm) Advanced materials research ; Volume 1038. https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1910949 Click to View |
| language |
English |
| format |
Conference Proceeding eBook |
| author2 |
Franke, Jorg, |
| author_facet |
Franke, Jorg, International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany) |
| author2_variant |
j f jf |
| author2_role |
TeilnehmendeR |
| author_corporate |
International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany) |
| author_sort |
International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany) |
| title |
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / |
| spellingShingle |
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / Advanced Materials Research, |
| title_sub |
scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / |
| title_full |
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jorg Franke [and three others]. |
| title_fullStr |
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jorg Franke [and three others]. |
| title_full_unstemmed |
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jorg Franke [and three others]. |
| title_auth |
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / |
| title_new |
11th international congress molded interconnect devices : |
| title_sort |
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th international congress molded interconnect devices (mid 2014), september 24-25, 2014, nuremberg / fuerth, germany / |
| series |
Advanced Materials Research, |
| series2 |
Advanced Materials Research, |
| publisher |
TTP, |
| publishDate |
2014 |
| physical |
1 online resource (119 pages) : illustrations. |
| isbn |
9783038266365 9783038352525 |
| issn |
1662-8985 ; |
| callnumber-first |
T - Technology |
| callnumber-subject |
TK - Electrical and Nuclear Engineering |
| callnumber-label |
TK7882 |
| callnumber-sort |
TK 47882 I6 I584 42014 |
| genre |
Electronic books. |
| genre_facet |
Congresses. Electronic books. |
| url |
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1910949 |
| illustrated |
Illustrated |
| dewey-hundreds |
600 - Technology |
| dewey-tens |
620 - Engineering |
| dewey-ones |
621 - Applied physics |
| dewey-full |
621.367 |
| dewey-sort |
3621.367 |
| dewey-raw |
621.367 |
| dewey-search |
621.367 |
| oclc_num |
893677821 |
| work_keys_str_mv |
AT internationalcongressmoldedinterconnectdevicesnurembergfuerthgermany 11thinternationalcongressmoldedinterconnectdevicesscientificproceedingsselectedpeerreviewedpapersfromthe11thinternationalcongressmoldedinterconnectdevicesmid2014september24252014nurembergfuerthgermany AT frankejorg 11thinternationalcongressmoldedinterconnectdevicesscientificproceedingsselectedpeerreviewedpapersfromthe11thinternationalcongressmoldedinterconnectdevicesmid2014september24252014nurembergfuerthgermany |
| status_str |
n |
| ids_txt_mv |
(MiAaPQ)5001910949 (Au-PeEL)EBL1910949 (CaPaEBR)ebr10951273 (OCoLC)893677821 |
| hierarchy_parent_title |
Advanced Materials Research, Volume 1038 |
| hierarchy_sequence |
Volume 1038. |
| is_hierarchy_title |
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / |
| container_title |
Advanced Materials Research, Volume 1038 |
| author2_original_writing_str_mv |
noLinkedField |
| _version_ |
1792330806480338944 |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02619nam a2200457 i 4500</leader><controlfield tag="001">5001910949</controlfield><controlfield tag="003">MiAaPQ</controlfield><controlfield tag="005">20200903223051.0</controlfield><controlfield tag="006">m o d | </controlfield><controlfield tag="007">cr cnu||||||||</controlfield><controlfield tag="008">141017t20142014sz a ob 001 0 eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9783038352525</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038266365</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(MiAaPQ)5001910949</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(Au-PeEL)EBL1910949</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CaPaEBR)ebr10951273</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)893677821</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">MiAaPQ</subfield><subfield code="b">eng</subfield><subfield code="e">rda</subfield><subfield code="e">pn</subfield><subfield code="c">MiAaPQ</subfield><subfield code="d">MiAaPQ</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TK7882.I6</subfield><subfield code="b">.I584 2014</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.367</subfield><subfield code="2">23</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">International Congress Molded Interconnect Devices</subfield><subfield code="n">(11th :</subfield><subfield code="d">2014 :</subfield><subfield code="c">Nuremberg / Fuerth, Germany)</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">11th international congress molded interconnect devices :</subfield><subfield code="b">scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /</subfield><subfield code="c">edited by Jorg Franke [and three others].</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Pfaffikon, Switzerland :</subfield><subfield code="b">TTP,</subfield><subfield code="c">2014.</subfield></datafield><datafield tag="264" ind1=" " ind2="2"><subfield code="a">Enfield, New Hampshire :</subfield><subfield code="b">Trans Tech Publications Ltd,</subfield><subfield code="c">[date of distribution not identified]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (119 pages) :</subfield><subfield code="b">illustrations.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Advanced Materials Research,</subfield><subfield code="x">1662-8985 ;</subfield><subfield code="v">Volume 1038</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references at the end of each chapters and index.</subfield></datafield><datafield tag="588" ind1=" " ind2=" "><subfield code="a">Description based on online resource; title from PDF title page (ebrary, viewed October 16, 2014).</subfield></datafield><datafield tag="590" ind1=" " ind2=" "><subfield code="a">Electronic reproduction. Ann Arbor, MI : ProQuest, 2016. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Molded interconnect devices.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Three-dimensional display systems</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="655" ind1=" " ind2="4"><subfield code="a">Electronic books.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Franke, Jorg,</subfield><subfield code="e">editor.</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="a">International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany)</subfield><subfield code="t">11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.</subfield><subfield code="d">Pfaffikon, Switzerland : TTP, c2014 </subfield><subfield code="h">124 pages </subfield><subfield code="k">Advanced materials research ; Volume 1038.</subfield><subfield code="z">9783038352525</subfield></datafield><datafield tag="797" ind1="2" ind2=" "><subfield code="a">ProQuest (Firm)</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Advanced materials research ;</subfield><subfield code="v">Volume 1038.</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1910949</subfield><subfield code="z">Click to View</subfield></datafield></record></collection> |