Components, packaging and manufacturing technology II : : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / / edited by Andy Wu.

Saved in:
Bibliographic Details
Superior document:Applied Mechanics and Materials, Volume 509
TeilnehmendeR:
Place / Publishing House:Zurich, Switzerland : : TTP,, 2014.
2014
Year of Publication:2014
Language:English
Series:Applied mechanics and materials ; Volume 509.
Online Access:
Physical Description:1 online resource (245 pages) :; illustrations.
Tags: Add Tag
No Tags, Be the first to tag this record!
id 5001910710
ctrlnum (MiAaPQ)5001910710
(Au-PeEL)EBL1910710
(CaPaEBR)ebr10846262
(OCoLC)899159011
collection bib_alma
record_format marc
spelling Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu.
Zurich, Switzerland : TTP, 2014.
2014
1 online resource (245 pages) : illustrations.
text rdacontent
computer rdamedia
online resource rdacarrier
Applied Mechanics and Materials, 1662-7482 ; Volume 509
Includes bibliographical references and indexes.
Description based on online resource; title from PDF title page (ebrary, viewed March 21, 2014).
Electronic reproduction. Ann Arbor, MI : ProQuest, 2016. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Electronic apparatus and appliances Congresses.
Electronic packaging Congresses.
Microelectronic packaging Congresses.
Manufacturing processes Congresses.
Electronic books.
Wu, Andy, editor.
Print version: Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia. Zurich, Switzerland : TTP, c2014 241 pages Applied mechanics and materials ; Volume 509. 9783038350132
ProQuest (Firm)
Applied mechanics and materials ; Volume 509.
https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1910710 Click to View
language English
format eBook
author2 Wu, Andy,
author_facet Wu, Andy,
author2_variant a w aw
author2_role TeilnehmendeR
title Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
spellingShingle Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Applied Mechanics and Materials,
title_sub selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
title_full Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu.
title_fullStr Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu.
title_full_unstemmed Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu.
title_auth Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
title_new Components, packaging and manufacturing technology II :
title_sort components, packaging and manufacturing technology ii : selected, peer reviewed papers from the 2013 3rd international conference on packaging and manufacturing technology (iccpmt 2013), december 31, 2013 - january 2, 2014, brisbane australia /
series Applied Mechanics and Materials,
series2 Applied Mechanics and Materials,
publisher TTP,
publishDate 2014
physical 1 online resource (245 pages) : illustrations.
isbn 9783038263944
9783038350132
issn 1662-7482 ;
callnumber-first T - Technology
callnumber-subject TK - Electrical and Nuclear Engineering
callnumber-label TK7801
callnumber-sort TK 47801 C667 42014
genre Electronic books.
genre_facet Congresses.
Electronic books.
url https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1910710
illustrated Illustrated
dewey-hundreds 600 - Technology
dewey-tens 620 - Engineering
dewey-ones 621 - Applied physics
dewey-full 621.381
dewey-sort 3621.381
dewey-raw 621.381
dewey-search 621.381
oclc_num 899159011
work_keys_str_mv AT wuandy componentspackagingandmanufacturingtechnologyiiselectedpeerreviewedpapersfromthe20133rdinternationalconferenceonpackagingandmanufacturingtechnologyiccpmt2013december312013january22014brisbaneaustralia
status_str n
ids_txt_mv (MiAaPQ)5001910710
(Au-PeEL)EBL1910710
(CaPaEBR)ebr10846262
(OCoLC)899159011
hierarchy_parent_title Applied Mechanics and Materials, Volume 509
hierarchy_sequence Volume 509.
is_hierarchy_title Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
container_title Applied Mechanics and Materials, Volume 509
author2_original_writing_str_mv noLinkedField
_version_ 1792330806307323904
fullrecord <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02360nam a2200457 i 4500</leader><controlfield tag="001">5001910710</controlfield><controlfield tag="003">MiAaPQ</controlfield><controlfield tag="005">20200903223051.0</controlfield><controlfield tag="006">m o d | </controlfield><controlfield tag="007">cr cnu||||||||</controlfield><controlfield tag="008">140321t20142014sz a ob 001 0 eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9783038350132</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038263944</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(MiAaPQ)5001910710</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(Au-PeEL)EBL1910710</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(CaPaEBR)ebr10846262</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)899159011</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">MiAaPQ</subfield><subfield code="b">eng</subfield><subfield code="e">rda</subfield><subfield code="e">pn</subfield><subfield code="c">MiAaPQ</subfield><subfield code="d">MiAaPQ</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TK7801</subfield><subfield code="b">.C667 2014</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="0" ind2="0"><subfield code="a">Components, packaging and manufacturing technology II :</subfield><subfield code="b">selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /</subfield><subfield code="c">edited by Andy Wu.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Zurich, Switzerland :</subfield><subfield code="b">TTP,</subfield><subfield code="c">2014.</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (245 pages) :</subfield><subfield code="b">illustrations.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Applied Mechanics and Materials,</subfield><subfield code="x">1662-7482 ;</subfield><subfield code="v">Volume 509</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and indexes.</subfield></datafield><datafield tag="588" ind1=" " ind2=" "><subfield code="a">Description based on online resource; title from PDF title page (ebrary, viewed March 21, 2014).</subfield></datafield><datafield tag="590" ind1=" " ind2=" "><subfield code="a">Electronic reproduction. Ann Arbor, MI : ProQuest, 2016. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Electronic apparatus and appliances</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Electronic packaging</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Microelectronic packaging</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Manufacturing processes</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="655" ind1=" " ind2="4"><subfield code="a">Electronic books.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wu, Andy,</subfield><subfield code="e">editor.</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="t">Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia.</subfield><subfield code="d">Zurich, Switzerland : TTP, c2014 </subfield><subfield code="h">241 pages </subfield><subfield code="k">Applied mechanics and materials ; Volume 509.</subfield><subfield code="z">9783038350132</subfield></datafield><datafield tag="797" ind1="2" ind2=" "><subfield code="a">ProQuest (Firm)</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Applied mechanics and materials ;</subfield><subfield code="v">Volume 509.</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=1910710</subfield><subfield code="z">Click to View</subfield></datafield></record></collection>